Title :
Temporal behavior of microplasma and its coupling phenomena in silicon channel devices
Author :
Kim, Eung Soo ; Choi, Dong San ; Park, Sung-Jin ; Eden, J.Gary
Author_Institution :
Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, 1406 West Green Street, 61801 USA
Abstract :
Summary form only given. The spatiotemporal behavior of microplasmas produced with a silicon microchannel device having a transverse electrode structure has been studied by optical microscopy. For the experiments reported here, the microchannels have a width of 50 µm and a depth of ∼30 µm, and are fabricated in a 380 µm thick Si wafer, Along the rim of the channel is deposited a metal film electrode that is periodic having a square wave pattern and an edge-to-edge spacing of 50 µm. The channel and electrodes are overcoated with a multi-dielectric film stack to yield a micro dielectric barrier discharge (DBD) device.
Keywords :
Couplings; Electrodes; Films; Microchannel; Plasmas; Silicon; USA Councils;
Conference_Titel :
Plasma Science (ICOPS), 2012 Abstracts IEEE International Conference on
Conference_Location :
Edinburgh
Print_ISBN :
978-1-4577-2127-4
Electronic_ISBN :
0730-9244
DOI :
10.1109/PLASMA.2012.6383298