• DocumentCode
    2553176
  • Title

    An illustration of 90nm CMOS layout on PC

  • Author

    Sicard, Etienne ; Dhia, Sonia Ben

  • Author_Institution
    INSA, DGEI, Toulouse, France
  • Volume
    1
  • fYear
    2004
  • fDate
    3-5 Nov. 2004
  • Firstpage
    315
  • Lastpage
    318
  • Abstract
    The 90nm CMOS process technology, in commercial production in 2004, includes copper interconnects, 6 to 12 metal layers and 5-10 types of MOS devices. In co-operation with ST-microelectronics, the layout editor/simulator Microwind has been configured to support this state-of-the art CMOS process for research and training purpose. This paper describes the recent developments and their application to microelectronics training.
  • Keywords
    CMOS integrated circuits; MIS devices; integrated circuit interconnections; integrated circuit layout; 90 nm; CMOS process technology; Cu; MOS device; ST-microelectronics; copper interconnects; layout editor/simulator Microwind; metal layers; microelectronics training; Art; CMOS logic circuits; CMOS process; CMOS technology; Central Processing Unit; Circuit simulation; Computational modeling; Copper; Integrated circuit interconnections; MOS devices;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Devices, Circuits and Systems, 2004. Proceedings of the Fifth IEEE International Caracas Conference on
  • Print_ISBN
    0-7803-8777-5
  • Type

    conf

  • DOI
    10.1109/ICCDCS.2004.1393404
  • Filename
    1393404