Parametric simulations of a micromachined mesoscopic acoustic speaker

Author

Ayatollahi, Fatima Lina ; Majlis, Burhanuddin Yeop

Author_Institution

Inst. of Microeng. & Nanoelectron., Univ. Kebangsaan Malaysia, Bangi

fYear

2008

fDate

25-27 Nov. 2008

Firstpage

193

Lastpage

197

Abstract

This paper presents parametric simulations of a micromachined mesoscopic acoustic speaker for hearing aid applications. The microspeaker has a single turn copper coil on a polyimide membrane, and a NdFeB permanent magnet beneath the membrane. The fields due to the permanent magnet were computed using FEMM. Then, forces based on the fields and on the coil driving current were computed. Finally, IntelliSuite was employed to simulate membrane displacements and stresses. The device, with a polyimide membrane diameter of 2.5 mm and thickness of 2 mum, consumes 0.1 mW to generate a sound pressure level of 120 dB in the human ear.

Keywords

acoustic devices; boron alloys; copper; finite element analysis; hearing aids; iron alloys; mesoscopic systems; micromachining; micromechanical devices; neodymium alloys; permanent magnets; FEMM; IntelliSuite; NdFeB; coil driving current; finite element method magnetics; hearing aid; membrane displacement; membrane stresses; micromachined mesoscopic acoustic speaker; microspeaker; parametric simulation; permanent magnet; polyimide membrane; power 0.1 mW; single turn copper coil; size 2 mum; size 2.5 mm; Acoustic applications; Auditory system; Biomembranes; Coils; Computational modeling; Copper; Loudspeakers; Permanent magnets; Polyimides; Stress;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Electronics, 2008. ICSE 2008. IEEE International Conference on

Conference_Location

Johor Bahru

Print_ISBN

978-1-4244-3873-0

Electronic_ISBN

978-1-4244-2561-7

Type

conf

DOI

10.1109/SMELEC.2008.4770306

Filename

4770306