DocumentCode :
2554021
Title :
First resonance frequency and high sensitivity for MEMS acoustic sensors
Author :
Ganji, Bahram Azizollah ; Majlis, Burhanuddin Yeop ; Rastegar, Saeed
Author_Institution :
Dept. of Electr. Eng., Babol Univ. of Technol., Babol
fYear :
2008
fDate :
25-27 Nov. 2008
Firstpage :
239
Lastpage :
244
Abstract :
In this paper, the first resonance frequency of the clamped square diaphragm of the capacitive acoustic sensor has been calculated using variational iteration method (VIM). The equivalent electrical circuit model using lumped parameters has been used to obtain the sensitivity of the sensor. The aim is to develop the microphones with high sensitivity and flat frequency response in hearing range. The high sensitivity can be obtained by changing the initial stress of diaphragm, sigmar, diaphragm size, a, diaphragm thickness, t, back plate thickness, h, air gap thickness, d, back plate hole radius, r, surface area fraction occupied by the holes, a., and bias voltage. The optimized structure has a diaphragm thickness of 0.8 mum, a diaphragm area of 2.43 mm2, an air gap of 4.0 mum and a 1.0 mum thick back plate with acoustical ports. The device shows maximum sensitivity 47.9mV/Pa, with a high frequency response extending to 18 kHz.
Keywords :
acoustic devices; air gaps; equivalent circuits; iterative methods; microphones; microsensors; MEMS acoustic sensors; air gap thickness; back plate hole radius; back plate thickness; capacitive acoustic sensor; clamped square diaphragm; diaphragm size; diaphragm thickness; equivalent electrical circuit model; frequency 18 kHz; microphones; resonance frequency; sensor sensivity; size 0.8 mum; size 1.0 mum; size 4.0 mum; variational iteration method; Acoustic sensors; Auditory system; Circuits; Frequency response; Micromechanical devices; Microphones; Resonance; Resonant frequency; Stress; Voltage; Acoustic sensor; MEMS; Resonance frequency; Sensitivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Electronics, 2008. ICSE 2008. IEEE International Conference on
Conference_Location :
Johor Bahru
Print_ISBN :
978-1-4244-3873-0
Electronic_ISBN :
978-1-4244-2561-7
Type :
conf
DOI :
10.1109/SMELEC.2008.4770315
Filename :
4770315
Link To Document :
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