DocumentCode
255432
Title
Failure characteristics of discrete power semiconductor packages exceeding electrical specifications
Author
Gleissner, Michael ; Bakran, Mark M.
Author_Institution
Dept. of Mechatron., Univ. of Bayreuth, Bayreuth, Germany
fYear
2014
fDate
26-28 Aug. 2014
Firstpage
1
Lastpage
10
Abstract
The failure characteristics of power semiconductors determine necessary protection elements and fault-tolerance of the total system. To obtain information on failure characteristics, several low voltage power MOSFETs with different packages, manufacturers and voltage ratings are deliberately destroyed by exceeding the electrical parameters gate- and drain-source voltage. Furthermore, the stability of MOSFETs during a capacitor discharging depending on the amount of stored energy is investigated, which is necessary for successful level reduction in multilevel converters. The research focuses on the device behaviour after failure depending on the package technology to give a design hint for fault-tolerant applications.
Keywords
failure analysis; fault tolerance; low-power electronics; power MOSFET; semiconductor device packaging; capacitor discharging; discrete power semiconductor packages; drain-source voltage; electrical specifications; failure characteristics; fault tolerance; gate-source voltage; low voltage power MOSFET; multilevel converters; protection elements; voltage ratings; Current measurement; Fault tolerance; Fault tolerant systems; Logic gates; MOSFET; Resistance; Voltage control; Discrete power device; Faults; MOSFET; Packaging; Reliability; Robustness;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Electronics and Applications (EPE'14-ECCE Europe), 2014 16th European Conference on
Conference_Location
Lappeenranta
Type
conf
DOI
10.1109/EPE.2014.6910743
Filename
6910743
Link To Document