DocumentCode :
255432
Title :
Failure characteristics of discrete power semiconductor packages exceeding electrical specifications
Author :
Gleissner, Michael ; Bakran, Mark M.
Author_Institution :
Dept. of Mechatron., Univ. of Bayreuth, Bayreuth, Germany
fYear :
2014
fDate :
26-28 Aug. 2014
Firstpage :
1
Lastpage :
10
Abstract :
The failure characteristics of power semiconductors determine necessary protection elements and fault-tolerance of the total system. To obtain information on failure characteristics, several low voltage power MOSFETs with different packages, manufacturers and voltage ratings are deliberately destroyed by exceeding the electrical parameters gate- and drain-source voltage. Furthermore, the stability of MOSFETs during a capacitor discharging depending on the amount of stored energy is investigated, which is necessary for successful level reduction in multilevel converters. The research focuses on the device behaviour after failure depending on the package technology to give a design hint for fault-tolerant applications.
Keywords :
failure analysis; fault tolerance; low-power electronics; power MOSFET; semiconductor device packaging; capacitor discharging; discrete power semiconductor packages; drain-source voltage; electrical specifications; failure characteristics; fault tolerance; gate-source voltage; low voltage power MOSFET; multilevel converters; protection elements; voltage ratings; Current measurement; Fault tolerance; Fault tolerant systems; Logic gates; MOSFET; Resistance; Voltage control; Discrete power device; Faults; MOSFET; Packaging; Reliability; Robustness;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Electronics and Applications (EPE'14-ECCE Europe), 2014 16th European Conference on
Conference_Location :
Lappeenranta
Type :
conf
DOI :
10.1109/EPE.2014.6910743
Filename :
6910743
Link To Document :
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