DocumentCode :
2554565
Title :
Packaging of a massively parallel signal processor for spaceflight
Author :
Johnson, David C. ; Forman, Steven E. ; Retherford, Larry L. ; Mendenhall, Linda M. ; Hein, Travis L.
Author_Institution :
Lincoln Lab., MIT, Lexington, MA, USA
Volume :
5
fYear :
2000
fDate :
2000
Firstpage :
307
Abstract :
Concepts for the packaging of a massively parallel signal processor for a radar surveillance satellite are investigated. The signal processor assumed employs 32 custom processor dice arranged as a parallel computer. The significant packaging challenge is interconnection of the various processor dice while maintaining a stringent time-of-flight requirement for the high speed signals. The total number of interconnects for the 32 dice is approximately 12,800 where the high speed interconnect requirement concerns approximately 4800 interconnects. Various packaging and routing strategies are investigated with a statistical comparison of the routes provided
Keywords :
VLSI; avionics; ball grid arrays; chip scale packaging; circuit layout CAD; integrated circuit layout; multichip modules; parallel architectures; radar signal processing; search radar; space vehicle electronics; BGA; CAD routing; CSP; Discoverer II spacecraft; MCM; VLSI; custom processor dice; high speed interconnect requirement; high speed signals; interconnection; massively parallel signal processor; packaging concepts; parallel computer; radar surveillance satellite; routing strategies; statistical comparison; time-of-flight requirement; Chip scale packaging; Electronics packaging; Radar signal processing; Routing; Satellites; Signal processing; Space vehicles; Spaceborne radar; Surveillance; Timing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Aerospace Conference Proceedings, 2000 IEEE
Conference_Location :
Big Sky, MT
ISSN :
1095-323X
Print_ISBN :
0-7803-5846-5
Type :
conf
DOI :
10.1109/AERO.2000.878502
Filename :
878502
Link To Document :
بازگشت