Title :
Thermal management issues in Laser diode packaging
Author :
Verma, Alok Jyoti ; Makkar, R. ; Chalapathi, K.
Author_Institution :
Soc. for Appl. Microwave Electron. Eng.&Res. (SAMEER), Mumbai
Abstract :
SAMEER has recently setup an infrastructure to dasiapigtail and package laser diodespsila using optical epoxy and laser weld techniques. Few laser diodes have been packaged using dasiafiber alignment and laser weld system (FALWS)psila in butterfly and TO-CAN packages. The high power laser diode packaging involves good thermal management and post-weld shift challenges, and it is being experimentally verified with theoretical simulation. The laser diode packaging followed by reliability test as per Telcordia standard is the current technical challenges ahead.
Keywords :
semiconductor lasers; thermal management (packaging); TO-CAN packages; fiber alignment and laser weld system; laser diode packaging; optical epoxy; pigtail laser diodes; thermal management; Diode lasers; Electronic packaging thermal management; Erbium-doped fiber lasers; Laser excitation; Laser theory; Optical pumping; Power lasers; Pump lasers; Temperature; Thermal management; Fiber -alignment; High Power Laser Diode; Laser weld;
Conference_Titel :
Semiconductor Electronics, 2008. ICSE 2008. IEEE International Conference on
Conference_Location :
Johor Bahru
Print_ISBN :
978-1-4244-3873-0
Electronic_ISBN :
978-1-4244-2561-7
DOI :
10.1109/SMELEC.2008.4770349
