Title :
Miniaturized ultra-wideband band-pass-filter from Silicon Integrated Passive Device technology
Author :
Liu, Kai ; Frye, Robert C. ; Emigh, Roger
Author_Institution :
STATS ChipPAC, Inc., Tempe, AZ, USA
Abstract :
In front-end modules of UWB applications, there are BPFs used to make the applications complying with the FCC´s spectrum mask regulations at the transmitter paths, and to improve signal selectivity and receiving sensitivity at the receiver paths. Most of the UWB filtes in the applications now are made on printed circuit boards (PCBs) or using LTCC technology. We have developed a miniaturized UWB band-pass-filter using Silicon Integrated Passive Device (IPD) technology. The size of the filter is 1.6 times 1.2 times 0.4 mm3, which is by far the smallest UWB filter achieving similar functions, to the best of our knowledge. A hybrid EM-circuit optimization scheme has been adopted for the design. Prototypes are made and measured. Good agreement has been achieved between designed results and probed data. This small form-factor UWB filter may be well used in SiP applications to reduce discrete filters, or to save large board areas used to implement such filtering functions.
Keywords :
band-pass filters; ceramic packaging; passive filters; printed circuits; receivers; sensitivity; ultra wideband technology; LTCC technology; UWB applications; printed circuit boards; receiver paths; receiving sensitivity; signal selectivity; silicon integrated passive device; ultra-wideband band-pass-filter; Band pass filters; Dielectric substrates; Integrated circuit technology; Packaging; Passive filters; Printed circuits; Radio frequency; Radio transmitters; Silicon; Ultra wideband technology; Integrated Passive Device; System in Package; UWB; filter; flip-chip;
Conference_Titel :
Microwave Symposium Digest, 2009. MTT '09. IEEE MTT-S International
Conference_Location :
Boston, MA
Print_ISBN :
978-1-4244-2803-8
Electronic_ISBN :
0149-645X
DOI :
10.1109/MWSYM.2009.5165882