• DocumentCode
    2555150
  • Title

    Miniaturized ultra-wideband band-pass-filter from Silicon Integrated Passive Device technology

  • Author

    Liu, Kai ; Frye, Robert C. ; Emigh, Roger

  • Author_Institution
    STATS ChipPAC, Inc., Tempe, AZ, USA
  • fYear
    2009
  • fDate
    7-12 June 2009
  • Firstpage
    1057
  • Lastpage
    1060
  • Abstract
    In front-end modules of UWB applications, there are BPFs used to make the applications complying with the FCC´s spectrum mask regulations at the transmitter paths, and to improve signal selectivity and receiving sensitivity at the receiver paths. Most of the UWB filtes in the applications now are made on printed circuit boards (PCBs) or using LTCC technology. We have developed a miniaturized UWB band-pass-filter using Silicon Integrated Passive Device (IPD) technology. The size of the filter is 1.6 times 1.2 times 0.4 mm3, which is by far the smallest UWB filter achieving similar functions, to the best of our knowledge. A hybrid EM-circuit optimization scheme has been adopted for the design. Prototypes are made and measured. Good agreement has been achieved between designed results and probed data. This small form-factor UWB filter may be well used in SiP applications to reduce discrete filters, or to save large board areas used to implement such filtering functions.
  • Keywords
    band-pass filters; ceramic packaging; passive filters; printed circuits; receivers; sensitivity; ultra wideband technology; LTCC technology; UWB applications; printed circuit boards; receiver paths; receiving sensitivity; signal selectivity; silicon integrated passive device; ultra-wideband band-pass-filter; Band pass filters; Dielectric substrates; Integrated circuit technology; Packaging; Passive filters; Printed circuits; Radio frequency; Radio transmitters; Silicon; Ultra wideband technology; Integrated Passive Device; System in Package; UWB; filter; flip-chip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest, 2009. MTT '09. IEEE MTT-S International
  • Conference_Location
    Boston, MA
  • ISSN
    0149-645X
  • Print_ISBN
    978-1-4244-2803-8
  • Electronic_ISBN
    0149-645X
  • Type

    conf

  • DOI
    10.1109/MWSYM.2009.5165882
  • Filename
    5165882