• DocumentCode
    2555920
  • Title

    A 60 GHz Rotman lens on a silicon wafer for system-on-a-chip and system-in-package applications

  • Author

    Lee, Woosung ; Kim, Jaeheung ; Cho, Choon Sik ; Yoon, Young Joong

  • Author_Institution
    Sch. of Electr. & Electron. Eng., Yonsei Univ., Seoul, South Korea
  • fYear
    2009
  • fDate
    7-12 June 2009
  • Firstpage
    1189
  • Lastpage
    1192
  • Abstract
    As a semiconductor microfabrication process is advanced, there are needs for implementing various components on a wafer. A 60 GHz Rotman lens on a silicon wafer has been proposed for system-on-a-chip (SoC) and system-in-package (SiP) applications. The lens was fabricated on a high resistivity silicon wafer in semiconductor process. The lens has five beam ports and seven array ports. It was observed from the measurement that the phase and the amplitude of the Rotman lens are well distributed. The beam patterns were synthesized from the measured S-parameters. The beam directions are plusmn30deg plusmn16deg, and 0deg, and the half power beam width are 15.37deg, 14.68deg, 14.53deg, 14.68deg, and 15.37deg, respectively. The feasibility of the lens on a silicon wafer has been well explored.
  • Keywords
    lenses; system-in-package; system-on-chip; wafer level packaging; wafer-scale integration; Rotman lens; frequency 60 GHz; high resistivity silicon wafer; semiconductor process; system-in-package application; system-on-a-chip; Application software; Conductivity; Dielectric resonator antennas; Dipole antennas; Lenses; Optical design; Radio frequency; Silicon; Space technology; System-on-a-chip; Rotman lens; SiP; SoP; high resistivity silicon wafer;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest, 2009. MTT '09. IEEE MTT-S International
  • Conference_Location
    Boston, MA
  • ISSN
    0149-645X
  • Print_ISBN
    978-1-4244-2803-8
  • Electronic_ISBN
    0149-645X
  • Type

    conf

  • DOI
    10.1109/MWSYM.2009.5165915
  • Filename
    5165915