DocumentCode
2555920
Title
A 60 GHz Rotman lens on a silicon wafer for system-on-a-chip and system-in-package applications
Author
Lee, Woosung ; Kim, Jaeheung ; Cho, Choon Sik ; Yoon, Young Joong
Author_Institution
Sch. of Electr. & Electron. Eng., Yonsei Univ., Seoul, South Korea
fYear
2009
fDate
7-12 June 2009
Firstpage
1189
Lastpage
1192
Abstract
As a semiconductor microfabrication process is advanced, there are needs for implementing various components on a wafer. A 60 GHz Rotman lens on a silicon wafer has been proposed for system-on-a-chip (SoC) and system-in-package (SiP) applications. The lens was fabricated on a high resistivity silicon wafer in semiconductor process. The lens has five beam ports and seven array ports. It was observed from the measurement that the phase and the amplitude of the Rotman lens are well distributed. The beam patterns were synthesized from the measured S-parameters. The beam directions are plusmn30deg plusmn16deg, and 0deg, and the half power beam width are 15.37deg, 14.68deg, 14.53deg, 14.68deg, and 15.37deg, respectively. The feasibility of the lens on a silicon wafer has been well explored.
Keywords
lenses; system-in-package; system-on-chip; wafer level packaging; wafer-scale integration; Rotman lens; frequency 60 GHz; high resistivity silicon wafer; semiconductor process; system-in-package application; system-on-a-chip; Application software; Conductivity; Dielectric resonator antennas; Dipole antennas; Lenses; Optical design; Radio frequency; Silicon; Space technology; System-on-a-chip; Rotman lens; SiP; SoP; high resistivity silicon wafer;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 2009. MTT '09. IEEE MTT-S International
Conference_Location
Boston, MA
ISSN
0149-645X
Print_ISBN
978-1-4244-2803-8
Electronic_ISBN
0149-645X
Type
conf
DOI
10.1109/MWSYM.2009.5165915
Filename
5165915
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