• DocumentCode
    2556524
  • Title

    A review of electrical and thermal multistress aging models

  • Author

    Cygan, P. ; Laghari, J.R.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
  • fYear
    1990
  • fDate
    3-6 Jun 1990
  • Firstpage
    15
  • Lastpage
    20
  • Abstract
    A review of the methods and models used in lifetime studies of solid insulators under single- and multiple-stress conditions is presented. The statistical methods used with this type of data are briefly described. These statistical methods include the two-parameter Weibull distribution and log-normal distribution, which are the two distributions most frequently used in aging studies. The most attention is given to lifetime models under multiple stresses which have recently generated considerable interest. In particular, several models under combined electrical and thermal stresses are presented and their applicability is analyzed and discussed. These include the multistress models proposed by L. Simoni (1981) and T.S. Ramu (1985), both using the inverse power law for electrical aging, the exponential model by B. Fallou et al. (1979), and the probabilistic model by G.C. Montanari and M. Cacciari (1989). The trend in the development of these models is discussed
  • Keywords
    ageing; insulation testing; life testing; statistical analysis; electrical multistress ageing; exponential model; inverse power law; lifetime studies; log-normal distribution; multiple-stress conditions; probabilistic model; solid insulators; statistical methods; thermal multistress aging models; two-parameter Weibull distribution; Aging; Capacitors; Compressive stress; Dielectric liquids; Dielectrics and electrical insulation; Gas insulation; Solids; Statistical analysis; Thermal degradation; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation, 1990., Conference Record of the 1990 IEEE International Symposium on
  • Conference_Location
    Toronto, Ont.
  • ISSN
    1089-084X
  • Type

    conf

  • DOI
    10.1109/ELINSL.1990.109698
  • Filename
    109698