• DocumentCode
    255653
  • Title

    Modular Multilevel Converter solutions with few Sub-Modules for wind power application

  • Author

    Smirnova, Liudmila ; Pyrhonen, Juha ; Ke Ma ; Blaabjerg, Frede

  • Author_Institution
    Lappeenranta Univ. of Technol., Lappeenranta, Finland
  • fYear
    2014
  • fDate
    26-28 Aug. 2014
  • Firstpage
    1
  • Lastpage
    10
  • Abstract
    Modular Multilevel Converter (MMC) is a topology where series connection of Sub-Modules (SM) is used to achieve almost sinusoidal output voltage. The MMC converter with a large number of SMs is actively used in high voltage DC (HVDC) transmission systems where a bulky converter is not a difficult issue. In this paper the possibility to use a MMC with just a few SMs for wind power application with limited space in the nacelle is analysed. The current loading, electrical losses and thermal performance of the power devices in the converter solutions studied are analysed. It is shown that an MMC converter with full-bridge (FB) SMs has a more uniform loss and temperature distribution among the semiconductor devices than an MMC with half-bridge (HB) SMs. The reliability of the MMC converters is also investigated in terms of thermal loading.
  • Keywords
    HVDC power convertors; HVDC power transmission; wind power; HVDC transmission; MMC converter; bulky converter; current loading; electrical loss; high voltage DC transmission; modular multilevel converter; power devices; semiconductor devices; series connection; sinusoidal output voltage; sub-modules; temperature distribution; thermal loading; thermal performance; wind power application; Current distribution; Insulated gate bipolar transistors; Loading; Modulation; Power conversion; Wind power generation; Multilevel converters; Reliability; Thermal stress; Wind energy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Electronics and Applications (EPE'14-ECCE Europe), 2014 16th European Conference on
  • Conference_Location
    Lappeenranta
  • Type

    conf

  • DOI
    10.1109/EPE.2014.6910860
  • Filename
    6910860