Title :
Applications of atomic force microscopy for semiconductor device and package characterization
Author :
Natarajan, M. ; Cui, C.Q. ; Poener, D.P. ; Radhakrishnan, M.K.
Author_Institution :
Inst. of Microelectron., Singapore
Abstract :
This paper presents the results of a few case studies carried out on semiconductor devices and packaging related materials. The emphasis is on the novel application of Scanning Probe Microscopy (SPM) techniques as compared to the traditional analysis. Also, application of two surface topography parameters of SPM, power spectral density and total surface area are briefly discussed
Keywords :
atomic force microscopy; semiconductor device packaging; surface topography measurement; atomic force microscopy; packaging; power spectral density; scanning probe microscopy; semiconductor device; surface topography; total surface area; Atomic force microscopy; Atomic measurements; Instruments; Microelectronics; Scanning probe microscopy; Semiconductor device packaging; Semiconductor devices; Surface contamination; Surface morphology; Surface topography;
Conference_Titel :
Physical & Failure Analysis of Integrated Circuits, 1997., Proceedings of the 1997 6th International Symposium on
Print_ISBN :
0-7803-3985-1
DOI :
10.1109/IPFA.1997.638349
