DocumentCode
2557035
Title
Applications of atomic force microscopy for semiconductor device and package characterization
Author
Natarajan, M. ; Cui, C.Q. ; Poener, D.P. ; Radhakrishnan, M.K.
Author_Institution
Inst. of Microelectron., Singapore
fYear
1997
fDate
21-25 Jul 1997
Firstpage
275
Lastpage
279
Abstract
This paper presents the results of a few case studies carried out on semiconductor devices and packaging related materials. The emphasis is on the novel application of Scanning Probe Microscopy (SPM) techniques as compared to the traditional analysis. Also, application of two surface topography parameters of SPM, power spectral density and total surface area are briefly discussed
Keywords
atomic force microscopy; semiconductor device packaging; surface topography measurement; atomic force microscopy; packaging; power spectral density; scanning probe microscopy; semiconductor device; surface topography; total surface area; Atomic force microscopy; Atomic measurements; Instruments; Microelectronics; Scanning probe microscopy; Semiconductor device packaging; Semiconductor devices; Surface contamination; Surface morphology; Surface topography;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical & Failure Analysis of Integrated Circuits, 1997., Proceedings of the 1997 6th International Symposium on
Print_ISBN
0-7803-3985-1
Type
conf
DOI
10.1109/IPFA.1997.638349
Filename
638349
Link To Document