Title :
Overview and Status of Numerical Electromagnetic Field Simulation Methods Applied to Integrated Circuits
Author :
Russer, Peter ; Bajon, Damienne ; Wane, Sidina ; Fichtner, Nikolaus
Author_Institution :
Inst. for High-Freq. Eng., Tech. Univ. Munchen, Munich
Abstract :
We give a presentation on numerical electromagnetic field simulation methods applied to integrated circuits and discuss challenges of chip, package and board co- design. Different modeling techniques are introduced where especially the application and need for hybrid methods is stressed. Also the need for global methodologies in simulating digital and analog signal behavior of ICs is discussed and illustrated by real system-in-package (SiP) examples.
Keywords :
electromagnetic fields; integrated circuit modelling; monolithic integrated circuits; system-on-package; IC analog signal simulation; IC digital signal simulation; chip-package-board co-design; electromagnetic field simulation methods; integrated circuits; system-in-package; Circuit simulation; Electromagnetic fields; Frequency; Germanium silicon alloys; Integrated circuit technology; MMICs; Numerical simulation; Power transmission lines; Silicon germanium; Transmission line matrix methods;
Conference_Titel :
Silicon Monolithic Integrated Circuits in RF Systems, 2009. SiRF '09. IEEE Topical Meeting on
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-3940-9
Electronic_ISBN :
978-1-4244-2831-1
DOI :
10.1109/SMIC.2009.4770510
