DocumentCode
2557557
Title
A novel approach for RF/microwave modeling and optimization of BGA packages
Author
Ndip, Ivan ; John, Werner ; Reichl, Herbert ; Thiede, Andreas
Volume
2
fYear
2005
fDate
25-28 July 2005
Firstpage
233
Lastpage
236
Keywords
Circuit testing; Electromagnetic coupling; Electromagnetic measurements; Electronics packaging; Information technology; Integrated circuit interconnections; Radio frequency; Scattering parameters; Transmission line discontinuities; Wideband;
fLanguage
English
Publisher
ieee
Conference_Titel
Research in Microelectronics and Electronics, 2005 PhD
Print_ISBN
0-7803-9345-7
Type
conf
DOI
10.1109/RME.2005.1542981
Filename
1542981
Link To Document