Title :
A novel approach for RF/microwave modeling and optimization of BGA packages
Author :
Ndip, Ivan ; John, Werner ; Reichl, Herbert ; Thiede, Andreas
Keywords :
Circuit testing; Electromagnetic coupling; Electromagnetic measurements; Electronics packaging; Information technology; Integrated circuit interconnections; Radio frequency; Scattering parameters; Transmission line discontinuities; Wideband;
Conference_Titel :
Research in Microelectronics and Electronics, 2005 PhD
Print_ISBN :
0-7803-9345-7
DOI :
10.1109/RME.2005.1542981
