Title :
A Micromachined High-Q Microstrip Line with a Broadband Microstrip-to-CPW Transistion
Author :
Hsu, Hao-Han ; Peroulis, Dimitrios
Author_Institution :
Birck Nanotechnol. Center, Purdue Univ., West Lafayette, IN
Abstract :
A high-Q micromachined microstrip line with its corresponding broadband microstrip-to-CPW transition is presented. The micromachined suspended-ground microstrip line is fabricated monolithically to eliminate the usage of multiple substrates and more complicated processes including wafer bonding and thru-substrate vias. Furthermore, via-less connections between the signal line and ground plane of the microstrip can be easily implemented. The fabricated 1-mm long suspended ground microstrip line with back-to-back transition shows an excellent RF performance with insertion loss of less than 0.36 dB and reflection below -18 dB over a broad bandwidth from dc to 30 GHz.
Keywords :
coplanar waveguides; microstrip lines; back-to-back transition; broadband microstrip-to-CPW transition; ground plane; insertion loss; micromachined high-Q microstrip line; signal line; size 1 mm; suspended ground microstrip line; thru-substrate vias; wafer bonding; Circuits; Coplanar waveguides; Fabrication; Impedance; Microstrip; Planar transmission lines; Q factor; Radio frequency; Wafer bonding; Waveguide transitions;
Conference_Titel :
Silicon Monolithic Integrated Circuits in RF Systems, 2009. SiRF '09. IEEE Topical Meeting on
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-3940-9
Electronic_ISBN :
978-1-4244-2831-1
DOI :
10.1109/SMIC.2009.4770534
