DocumentCode :
2558073
Title :
Influences of Dummy Metal Fills on CMOS VCO
Author :
Wang, Sen ; Wu, Hsien-Shun ; Tzuang, Ching-Kuang C.
Author_Institution :
Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei
fYear :
2009
fDate :
19-21 Jan. 2009
Firstpage :
1
Lastpage :
4
Abstract :
In this paper, influences on CMOS voltage controlled oscillator (VCO) caused by dummy metal fills are investigated. Two fully integrated VCOs are fabricated, tested and verified in 0.18-mum 1P6M bulk CMOS technology. The area-consuming inductors and capacitors of the VCOs are implemented by multilayer complementary-conducting- strip transmission lines (CCS TLs) and metal-oxcide-metal (MOM) capacitors, respectively. The two-dimensional (2-d) and multilayer CCS TL provides miniaturized design and facilitate the chip to satisfy the metal density rules required by foundry process. The two identical X-band VCOs are merely with different dummy metal patterns inserted by designers and foundry, respectively, for frequency tuning and power level comparisons. The comparisons demonstrate that the existence of the dummy metal fills inside and beside the CCS TL has significant influences on the VCO. Therefore, compared with the VCO whose dummy metal fills inserted randomly by foundry, the other VCO whose dummy metal fills inserted by designers is more predictable and reliable.
Keywords :
CMOS integrated circuits; capacitors; inductors; voltage-controlled oscillators; CMOS VCO; X-band VCOs; capacitors; dummy metal; inductors; metal density; multilayer complementary-conducting- strip transmission lines; CMOS technology; Capacitors; Carbon capture and storage; Foundries; Inductors; Nonhomogeneous media; Power transmission lines; Strips; Testing; Voltage-controlled oscillators;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Silicon Monolithic Integrated Circuits in RF Systems, 2009. SiRF '09. IEEE Topical Meeting on
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-3940-9
Electronic_ISBN :
978-1-4244-2831-1
Type :
conf
DOI :
10.1109/SMIC.2009.4770537
Filename :
4770537
Link To Document :
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