• DocumentCode
    2558156
  • Title

    Effects of wind tunnel orientation and mixed convection on heat transfer from a PQFP

  • Author

    Sikka, Kamal K. ; Fisher, Timothy S. ; Torrance, Kenneth E. ; Lamb, Charles R.

  • Author_Institution
    Sibley Sch. of Mech. & Aerosp. Eng., Cornell Univ., Ithaca, NY, USA
  • fYear
    1996
  • fDate
    29 May-1 Jun 1996
  • Firstpage
    21
  • Lastpage
    30
  • Abstract
    The thermal resistance of a surface-mount, plastic quad flat package (PQFP) was measured over a range of heating powers, air velocities, and package orientations. The package was mounted in a low-speed wind tunnel which could be rotated in the vertical plane, thus changing the orientation of the package with respect to the gravity vector. Results show that the regime of mixed correction is limited, for a horizontal package, to air velocities less than 2.5 m/s at a heating power of 4 W, i.e., to GrL*/ReL2 greater than about unity. In the mixed convection regime, variation of the wind tunnel inclination angle from buoyancy-opposed to buoyancy-assisted orientations decreases the total thermal resistance by 5% or more when the air velocity is less than 0.5 m/s at a heating power of 4 W, i.e., for GrL*/ReL2 greater than about ten. For air velocities greater than 2.5 m/s, for all tunnel orientations, the total thermal resistance shows a steep decrease. Flow visualization revealed that the resistance decrease appears to be due to restarting of the surface boundary layer on the package
  • Keywords
    convection; flow visualisation; integrated circuit packaging; plastic packaging; surface mount technology; thermal resistance; wind tunnels; 0.5 to 2.5 m/s; 4 W; PQFP; air velocities; buoyancy-assisted orientations; flow visualization; gravity vector; heat transfer; heating powers; horizontal package; mixed convection; package orientations; plastic quad flat package; surface boundary layer; surface-mount package; thermal resistance; wind tunnel inclination angle; wind tunnel orientation; Electronic packaging thermal management; Electronics packaging; Gravity; Heat engines; Heat transfer; Plastic packaging; Resistance heating; Surface resistance; Testing; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal Phenomena in Electronic Systems, 1996. I-THERM V., Inter-Society Conference on
  • Conference_Location
    Orlando, FL
  • Print_ISBN
    0-7803-3325-X
  • Type

    conf

  • DOI
    10.1109/ITHERM.1996.534541
  • Filename
    534541