Analysis of the influence of baffles and shields on the cooling of a digital transmission equipment

Author

Ramos, R.A.V. ; Milanez, L.F.

Author_Institution

DEM/FEIS-UNESP, Ilha Solteira, Brazil

fYear

1996

fDate

29 May-1 Jun 1996

Firstpage

31

Lastpage

37

Abstract

In this work design criteria for cooling of electronic systems used in a digital transmission equipment are considered. An experimental study using a simulated electronic equipment in which vertically oriented circuit boards are aligned to form vertical channels is carried out. Resistors are used to simulate actual components. The temperature of several components in the printed circuit boards are measured and the influence of the baffles and shields on the cooling effect are discussed. It was observed that the use of the baffles reduce the temperature levels and the use of shields, although protecting the components from magnetic effects, cause an increase in the temperature levels

Keywords

cooling; magnetic shielding; packaging; printed circuit layout; telecommunication equipment testing; baffles; cooling; digital transmission equipment; electronic systems; magnetic effects; shields; telecommunication systems; temperature levels; vertical channels; vertically oriented circuit boards; Circuit simulation; Electronic components; Electronic equipment; Electronics cooling; Packaging machines; Power system protection; Printed circuits; Resistors; Temperature; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal Phenomena in Electronic Systems, 1996. I-THERM V., Inter-Society Conference on

Conference_Location

Orlando, FL

Print_ISBN

0-7803-3325-X

Type

conf

DOI

10.1109/ITHERM.1996.534542

Filename

534542