Title :
Analysis of the influence of baffles and shields on the cooling of a digital transmission equipment
Author :
Ramos, R.A.V. ; Milanez, L.F.
Author_Institution :
DEM/FEIS-UNESP, Ilha Solteira, Brazil
fDate :
29 May-1 Jun 1996
Abstract :
In this work design criteria for cooling of electronic systems used in a digital transmission equipment are considered. An experimental study using a simulated electronic equipment in which vertically oriented circuit boards are aligned to form vertical channels is carried out. Resistors are used to simulate actual components. The temperature of several components in the printed circuit boards are measured and the influence of the baffles and shields on the cooling effect are discussed. It was observed that the use of the baffles reduce the temperature levels and the use of shields, although protecting the components from magnetic effects, cause an increase in the temperature levels
Keywords :
cooling; magnetic shielding; packaging; printed circuit layout; telecommunication equipment testing; baffles; cooling; digital transmission equipment; electronic systems; magnetic effects; shields; telecommunication systems; temperature levels; vertical channels; vertically oriented circuit boards; Circuit simulation; Electronic components; Electronic equipment; Electronics cooling; Packaging machines; Power system protection; Printed circuits; Resistors; Temperature; Thermal resistance;
Conference_Titel :
Thermal Phenomena in Electronic Systems, 1996. I-THERM V., Inter-Society Conference on
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-3325-X
DOI :
10.1109/ITHERM.1996.534542
