Title :
Study on thermal conductivity of Beijing roast duck subcutaneous tissue by microprobe
Author :
Jianxin, Wang ; Meili, Sui
Author_Institution :
Dept. of Electron. & Inf. Eng., Beijing Electron. Sci. & Technol. Inst., Beijing, China
Abstract :
Thermal conductivity is an important parameter in the Beijing roast duck processing, and have a vital significant to study the skin expanding craft of Beijing roast duck. The microprobe measurement method is adopted to test the duck subcutaneous tissue thermal conductivity. The results indicate that the duck subcutaneous tissue thermal conductivity between 0.1178 and 0.1973 W/(m·K) when the moisture content is change from 6.55 to 14.22%, thermal conductivity and moisture content have a strong linear correlation trend.
Keywords :
food products; moisture; thermal conductivity; Beijing roast duck subcutaneous tissue; duck subcutaneous tissue thermal conductivity; microprobe measurement method; moisture content; skin expanding craft; Conducting materials; Conductivity measurement; Heat transfer; Heating; Length measurement; Moisture; Temperature; Testing; Thermal conductivity; Wire; Beijing roast duck; Microprobe; Subcutaneous tissue; Thermal conductivity;
Conference_Titel :
Information Management and Engineering (ICIME), 2010 The 2nd IEEE International Conference on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4244-5263-7
Electronic_ISBN :
978-1-4244-5265-1
DOI :
10.1109/ICIME.2010.5478299
