Integrated EMI/thermal design for switching power supplies

Author

Zhang, Wei ; Lee, Fred C. ; Chen, Dan Y.

Author_Institution

Bradley Dept. of Electr. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA

Volume

1

fYear

2000

fDate

2000

Firstpage

47

Abstract

In this paper, the EMI and thermal performance of power supplies are taken into consideration in the board layout stage of the design cycle. The approach is based on using existing simulation tools, including parameter extracting software, a circuit simulation tool, and thermal analysis software. A power factor correcting circuit was used for the investigation. Examples are given for performance trade-offs for different circuit board layouts and different inductor winding schemes

Keywords

AC-DC power convertors; circuit layout; circuit simulation; electromagnetic interference; power factor correction; power inductors; rectifying circuits; switched mode power supplies; thermal analysis; circuit board layout; circuit simulation tool; design cycle; inductor winding schemes; integrated EMI/thermal design; parameter extracting software; performance trade-offs; power factor correcting circuit; simulation tools; switching power supplies; thermal analysis software; thermal performance; Analytical models; Capacitors; Circuit simulation; Computational modeling; Electromagnetic interference; Inductors; Power supplies; Predictive models; Printed circuits; Software tools;

fLanguage

English

Publisher

ieee

Conference_Titel

Power Electronics Specialists Conference, 2000. PESC 00. 2000 IEEE 31st Annual

Conference_Location

Galway

ISSN

0275-9306

Print_ISBN

0-7803-5692-6

Type

conf

DOI

10.1109/PESC.2000.878799

Filename

878799