• DocumentCode
    2558944
  • Title

    Pressure sensor design and simulation using the CAEMENS-D

  • Author

    Zhang, Y. ; Crary, S.B. ; Wise, K.D.

  • Author_Institution
    Center for Integrated Sensors & Circuits, Michigan Univ., Ann Arbor, MI, USA
  • fYear
    1990
  • fDate
    4-7 June 1990
  • Firstpage
    32
  • Lastpage
    35
  • Abstract
    A workstation-based simulation module for micromachined silicon diaphragm structures and its application to capacitive pressure transducers are reported. The module offers a menu-driven user interface, access to a growing database of material parameters and performance data, and an interface to commercial finite-element software. It provides the user with three-dimensional stress, deflection, resistance, and capacitance information and allows three-dimensional visualization of complex diaphragm structures. Finite-element simulations of boron-diffused, thin-diaphragm capacitive pressure transducers, produced using the dissolved-wafer process, allow effects such as diaphragm stress, dielectric-based stress compensation, corrugations and bosses to be explored. Detailed comparisons between the simulations and experimental data generally agree to within a few percent.<>
  • Keywords
    CAD; digital simulation; elemental semiconductors; micromechanical devices; pressure transducers; silicon; CAEMENS-D; Si:B; bosses; capacitive pressure transducers; complex diaphragm structures; corrugations; diaphragm stress; dielectric-based stress compensation; dissolved-wafer process; finite-element software; material parameters; menu-driven user interface; micromechanical diaphragm structures; three-dimensional stress; three-dimensional visualization; workstation-based simulation module; Application software; Capacitance; Data visualization; Finite element methods; Silicon; Software performance; Stress; Transducers; User interfaces; Visual databases;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensor and Actuator Workshop, 1990. 4th Technical Digest., IEEE
  • Conference_Location
    Hilton Head Island, SC, USA
  • Type

    conf

  • DOI
    10.1109/SOLSEN.1990.109814
  • Filename
    109814