DocumentCode
2558946
Title
Forward and reverse biased safe operating areas of the COOLMOSTM
Author
Zhang, Bo ; Xu, Zhenxue ; Huang, Alex Q.
Author_Institution
Bradley Dept. of Electr. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
Volume
1
fYear
2000
fDate
2000
Firstpage
81
Abstract
A new class of power MOSFET, called the COOLMOSTM, has recently been introduced with a very low on-resistance. In this paper, the forward and reverse biased safe operating areas and failure mechanisms of the COOLMOSTM are studied via experimental measurements and two-dimensional numerical simulations
Keywords
failure analysis; numerical analysis; power MOSFET; safety; semiconductor device measurement; semiconductor device models; semiconductor device reliability; semiconductor device testing; COOLMOSTM; experimental measurements; failure mechanisms; forward biased safe operating area; on-resistance; power MOSFET; reverse biased safe operating area; two-dimensional numerical simulations; Circuit testing; Doping; Failure analysis; Inductors; MOSFET circuits; Numerical simulation; Power MOSFET; Semiconductor diodes; Switches; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Electronics Specialists Conference, 2000. PESC 00. 2000 IEEE 31st Annual
Conference_Location
Galway
ISSN
0275-9306
Print_ISBN
0-7803-5692-6
Type
conf
DOI
10.1109/PESC.2000.878808
Filename
878808
Link To Document