Title :
Effective methodology for killer defect management in 300 mm DRAM fab
Author :
Lin, Luke ; Chen, J.Y. ; Chou, Eric ; Miura, Yuji ; Chang, Sandra ; Chiu, Jimmy
Author_Institution :
Powerchip Semicond. Co., Hsinchu, Taiwan
Abstract :
One new defect classification method called RDC (real-time defect classification) is used to manage killer defects in 300 mm DRAM production line after defect inspection by separating killer defects from all detected defects. Such method is proven to effectively monitor the trend of killer defects which help process engineer and integration engineer to enhance production yield by the watch of killer defect from RDC.
Keywords :
DRAM chips; inspection; production management; semiconductor device manufacture; 300 mm; DRAM production line; defect inspection; integration engineer; killer defect management; process engineer; real-time defect classification; Cleaning; Databases; Etching; Filtering; Inspection; Lithography; Monitoring; Production; Random access memory; Watches;
Conference_Titel :
Semiconductor Manufacturing Technology Workshop Proceedings, 2004
Print_ISBN :
0-7803-8469-5
DOI :
10.1109/SMTW.2004.1393721
