DocumentCode :
2559084
Title :
Viscoelasticity and creep recovery of polyimide thin films
Author :
Maseeh, F. ; Senturia, S.D.
Author_Institution :
Microsystems Technol. Lab., MIT, Cambridge, MA, USA
fYear :
1990
fDate :
4-7 June 1990
Firstpage :
55
Lastpage :
60
Abstract :
Creep and recovery of a polyimide thin film well below its glass transition temperature is demonstrated through use of a circular membrane bulge test. Extensive use is made of a recently developed mechanical CAD system linked to the fabrication process to model the structure. A creep power law is used in a nonlinear finite-element analysis to fit the experimental results, thereby measuring the viscoelastic properties. The use of circular membranes in measuring the viscoelastic and plastic material properties of thin films has some advantages over the uniaxial techniques. The membranes are edge free and therefore less susceptible to cracks which can prohibit observation of yield in glassy materials such as PI2525. The maximum stress region (center point) is also identified in advance; hence, the viscoelastic properties of thin films can be observed without having to yield or creep the entire sample. However, the analysis to determine the viscoelastic properties is more cumbersome. An attempt at such data analysis is presented. It has been determined that the creep compliance of PI2525 is a very nonlinear function of the stress (n=8) and also requires a threshold strain before creep begins.<>
Keywords :
finite element analysis; polymer films; recovery-creep; viscoelasticity; PI2525; circular membrane bulge test; creep compliance; creep power law; creep recovery; glassy materials; maximum stress region; mechanical CAD system; nonlinear finite-element analysis; nonlinear function; polyimide thin films; threshold strain; viscoelastic properties; Biomembranes; Creep; Elasticity; Glass; Polyimides; Stress; Temperature; Testing; Transistors; Viscosity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensor and Actuator Workshop, 1990. 4th Technical Digest., IEEE
Conference_Location :
Hilton Head Island, SC, USA
Type :
conf
DOI :
10.1109/SOLSEN.1990.109820
Filename :
109820
Link To Document :
بازگشت