DocumentCode
2559084
Title
Viscoelasticity and creep recovery of polyimide thin films
Author
Maseeh, F. ; Senturia, S.D.
Author_Institution
Microsystems Technol. Lab., MIT, Cambridge, MA, USA
fYear
1990
fDate
4-7 June 1990
Firstpage
55
Lastpage
60
Abstract
Creep and recovery of a polyimide thin film well below its glass transition temperature is demonstrated through use of a circular membrane bulge test. Extensive use is made of a recently developed mechanical CAD system linked to the fabrication process to model the structure. A creep power law is used in a nonlinear finite-element analysis to fit the experimental results, thereby measuring the viscoelastic properties. The use of circular membranes in measuring the viscoelastic and plastic material properties of thin films has some advantages over the uniaxial techniques. The membranes are edge free and therefore less susceptible to cracks which can prohibit observation of yield in glassy materials such as PI2525. The maximum stress region (center point) is also identified in advance; hence, the viscoelastic properties of thin films can be observed without having to yield or creep the entire sample. However, the analysis to determine the viscoelastic properties is more cumbersome. An attempt at such data analysis is presented. It has been determined that the creep compliance of PI2525 is a very nonlinear function of the stress (n=8) and also requires a threshold strain before creep begins.<>
Keywords
finite element analysis; polymer films; recovery-creep; viscoelasticity; PI2525; circular membrane bulge test; creep compliance; creep power law; creep recovery; glassy materials; maximum stress region; mechanical CAD system; nonlinear finite-element analysis; nonlinear function; polyimide thin films; threshold strain; viscoelastic properties; Biomembranes; Creep; Elasticity; Glass; Polyimides; Stress; Temperature; Testing; Transistors; Viscosity;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensor and Actuator Workshop, 1990. 4th Technical Digest., IEEE
Conference_Location
Hilton Head Island, SC, USA
Type
conf
DOI
10.1109/SOLSEN.1990.109820
Filename
109820
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