Title :
Verification of FEM analysis of load-deflection methods for measuring mechanical properties of thin films
Author :
Pan, J.Y. ; Lin, P. ; Maseeh, F. ; Senturia, S.D.
Author_Institution :
Microsyst. Technol. Lab., MIT, Cambridge, MA, USA
Abstract :
It is shown that in contrast to the analytical models, which have to assume a shape function, the finite-element method (FEM) model yields the shape function, and this shape function is in good agreement with experiment. Through an extensive FEM analysis of load-deflection methods, it is confirmed that while the functional form of the analytical result is correct, three constants in the model must be corrected by as much as 30%. Experimental measurements of the deformed membrane shape have been made, and they match the FEM results, verifying the accuracy of the FEM models. Experimental values extracted from load-deflection analysis for the biaxial modulus and the residual stress of thin films of Dupont PI2525 and Hitachi PIQ13 are presented.<>
Keywords :
elastic moduli; finite element analysis; internal stresses; polymer films; Dupont PI2525; FEM analysis; Hitachi PIQ13; accuracy; biaxial modulus; load-deflection methods; mechanical properties; model; residual stress; shape function; Analytical models; Biomembranes; Capacitive sensors; Finite element methods; Mechanical factors; Mechanical variables measurement; Residual stresses; Shape measurement; Solid modeling; Transistors;
Conference_Titel :
Solid-State Sensor and Actuator Workshop, 1990. 4th Technical Digest., IEEE
Conference_Location :
Hilton Head Island, SC, USA
DOI :
10.1109/SOLSEN.1990.109823
