Title :
Variable-flow microvalve structure fabricated with silicon fusion bonding
Author :
Pourahmadi, F. ; Christel, L. ; Petersen, K. ; Mallon, J. ; Bryzek, J.
Author_Institution :
NovaSensor, Fremont, CA, USA
Abstract :
The combination of silicon fusion bonding fabrication technology and detailed finite-element modeling is used to provide a framework for implementing a new concept in silicon microvalves. The device described is specifically designed for potential use in a current-to-pressure converter. The pressure inside the expansion chamber is controlled by adjusting the flow rate in a leakage path between the orifice and the chamber. Flow rate is regulated by a small valve, typically electromagnetically or piezoelectrically actuated, at flow rates of about 20 cm/sup 3//s. When the valve is fully open, the pressure in the chamber is minimized (3 psi); when the valve is closed, the pressure in the chamber is maximized (15 psi). Optimization of design features using finite-element analysis increased the deflection capability of the valve flapper by at least a factor of 5, over +or-75 mu m.<>
Keywords :
elemental semiconductors; finite element analysis; micromechanical devices; semiconductor technology; silicon; valves; 3 to 15 psi; Si; current-to-pressure converter; deflection capability; electromagnetic actuation; expansion chamber; finite-element analysis; finite-element modeling; flow rate; fusion bonding fabrication technology; leakage path; microvalves; piezoelectric actuation; valve flapper; Dielectrics; Etching; Fabrication; Fluid flow; Microvalves; Orifices; Pneumatic actuators; Silicon; Valves; Wafer bonding;
Conference_Titel :
Solid-State Sensor and Actuator Workshop, 1990. 4th Technical Digest., IEEE
Conference_Location :
Hilton Head Island, SC, USA
DOI :
10.1109/SOLSEN.1990.109825
