• DocumentCode
    2559257
  • Title

    Selectivity investigation of HfO2 to oxide using wet etching

  • Author

    Kang, Tsung-Kuei ; Wang, Chih-Cheng ; Tsui, Bing-Yue ; Li, Yuan-Hsin

  • Author_Institution
    Dept. of Electron. Eng., Feng-Chia Univ., Taichung, Taiwan
  • fYear
    2004
  • fDate
    9-10 Sept. 2004
  • Firstpage
    87
  • Lastpage
    90
  • Abstract
    Experiments indicate that higher HfO2/oxide etching selectivity in IPA/HF solution as compared to DI water/HF solution. Although DI water/HF solution is acceptable for some HfO2 and CVD oxide films, from an integration point of view, the process window is smaller than IPA/HF solution. It is believed that adequately damaged HfO2 and annealed CVD oxides will result in considerably high HfO2/CVD oxide etching selectivity in IPA/HF solution.
  • Keywords
    annealing; chemical vapour deposition; dielectric thin films; etching; hafnium compounds; semiconductor device manufacture; semiconductor technology; CVD oxide films; HfO2; oxide etching selectivity; wet etching; Atherosclerosis; Bonding; Hafnium oxide; Plasma applications; Plasma chemistry; Plasma density; Plasma measurements; Sputter etching; Sputtering; Wet etching;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing Technology Workshop Proceedings, 2004
  • Print_ISBN
    0-7803-8469-5
  • Type

    conf

  • DOI
    10.1109/SMTW.2004.1393729
  • Filename
    1393729