DocumentCode
2559257
Title
Selectivity investigation of HfO2 to oxide using wet etching
Author
Kang, Tsung-Kuei ; Wang, Chih-Cheng ; Tsui, Bing-Yue ; Li, Yuan-Hsin
Author_Institution
Dept. of Electron. Eng., Feng-Chia Univ., Taichung, Taiwan
fYear
2004
fDate
9-10 Sept. 2004
Firstpage
87
Lastpage
90
Abstract
Experiments indicate that higher HfO2/oxide etching selectivity in IPA/HF solution as compared to DI water/HF solution. Although DI water/HF solution is acceptable for some HfO2 and CVD oxide films, from an integration point of view, the process window is smaller than IPA/HF solution. It is believed that adequately damaged HfO2 and annealed CVD oxides will result in considerably high HfO2/CVD oxide etching selectivity in IPA/HF solution.
Keywords
annealing; chemical vapour deposition; dielectric thin films; etching; hafnium compounds; semiconductor device manufacture; semiconductor technology; CVD oxide films; HfO2; oxide etching selectivity; wet etching; Atherosclerosis; Bonding; Hafnium oxide; Plasma applications; Plasma chemistry; Plasma density; Plasma measurements; Sputter etching; Sputtering; Wet etching;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing Technology Workshop Proceedings, 2004
Print_ISBN
0-7803-8469-5
Type
conf
DOI
10.1109/SMTW.2004.1393729
Filename
1393729
Link To Document