Title :
Effects of aging on polyimide: a study of bulk and interface chemistry
Author :
Buncick, M.C. ; Denton, D.D.
Author_Institution :
Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
Abstract :
An analysis is presented of polyimides (PIs) exposed to heat and humidity stress over long periods. Electron spectroscopy for chemical analysis (ESCA) and Fourier transform infrared (FTIR) spectroscopy were used to investigate the basic physical mechanisms that affect PI when stressed. The results show that changes are confined to a surface layer at the PI-air interface. ESCA data show significant changes at the PI-air interface and that the PI-Si interface remains unchanged. FTIR transmission data indicate that the bulk chemistry is unaffected by such exposure. The surface chemistry is characterized by a significant reduction in the pyromellitic dyanhydride (PMDA) moiety and changes in the bonding of oxygen. There appear to be changes in the imide structure for the PI surface, but the mechanisms of change require further study. This has reliability implications for microelectronic systems using PI as a dielectric.<>
Keywords :
Fourier transform spectra; X-ray photoelectron spectra; ageing; dielectric properties of solids; dielectric thin films; integrated circuit technology; polymer films; spectrochemical analysis; surface chemistry; ESCA; FTIR; IC technology; XPS; aging; bonding; bulk chemistry; heat stress; humidity stress; imide structure; interface chemistry; microelectronic systems; polyimide; polymer films; pyromellitic dyanhydride moiety; reliability; surface chemistry; surface layer; Aging; Chemical analysis; Chemistry; Electrons; Fourier transforms; Humidity; Infrared spectra; Polyimides; Spectroscopy; Stress;
Conference_Titel :
Solid-State Sensor and Actuator Workshop, 1990. 4th Technical Digest., IEEE
Conference_Location :
Hilton Head Island, SC, USA
DOI :
10.1109/SOLSEN.1990.109830
