DocumentCode :
2559391
Title :
A pressure-balanced electrostatically-actuated microvalve
Author :
Huff, M.A. ; Mettner, M.S. ; Lober, T.A. ; Schmidt, M.A.
Author_Institution :
Microsyst. Technol. Lab., MIT, Cambridge, MA, USA
fYear :
1990
fDate :
4-7 June 1990
Firstpage :
123
Lastpage :
127
Abstract :
A new microvalve structure designed to enhance the limited actuation forces available in microfabricated devices by using a pressure-balancing scheme is reported. The concept is to allow the fluid to provide a balancing force on the moving part of the device, thereby reducing the force required to open the valve. Various methods can be used to actuate the valve, but electrostatic actuation is chosen since it is readily integrated with the valve fabrication sequence. The process for implementing the valve concept uses multiple wafer bonding steps (three in the present prototype) and has yielded valves which have been successfully actuated in air using voltages below 350 V.<>
Keywords :
electric actuators; electrohydraulic control equipment; micromechanical devices; valves; actuation forces; electrostatic actuation; electrostatically-actuated microvalve; microfabricated devices; multiple wafer bonding steps; pressure-balancing scheme; Electrostatic actuators; Etching; Fabrication; Microvalves; Nickel; Prototypes; Silicon; Valves; Voltage; Wafer bonding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensor and Actuator Workshop, 1990. 4th Technical Digest., IEEE
Conference_Location :
Hilton Head Island, SC, USA
Type :
conf
DOI :
10.1109/SOLSEN.1990.109835
Filename :
109835
Link To Document :
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