Title :
Real-time fault detection and classification for manufacturing etch tools
Author :
Chen, Mao-Shiung ; Yen, T.F. ; Coonan, Barry
Author_Institution :
ProMOS Technol. Inc, Hsinchu, Taiwan
Abstract :
Process control in semiconductor manufacturing has sought to improve yield, increase tool productivity and reduce manufacturing costs through the analysis of tool sensor outputs. Statistical process control (SPC) utilizes statistical algorithms to detect excursion events, but here a novel fault detection and classification (FDC) approach based upon a pattern recognition algorithm is presented. This FDC method from Straatum™ is real-time, outputting a chamber status metric known as the plasma index. The system is in place at ProMOS Technologies Inc, 200 mm manufacturing facility on various semiconductor tools - this document presents its implementation on a number of Tokyo™ DRM™ oxide etch tools and includes a number of case studies.
Keywords :
etching; fault location; pattern recognition; plasma materials processing; production equipment; production facilities; semiconductor device manufacture; statistical process control; DRM™; ProMOS Technologies Inc; Straatum™; Tokyo™; manufacturing etch tools; manufacturing facility; oxide etch tool; pattern recognition algorithm; plasma index; process control; real-time fault classification; real-time fault detection; semiconductor manufacturing; semiconductor tool; statistical process control; tool productivity; Costs; Etching; Event detection; Fault detection; Manufacturing processes; Pattern recognition; Plasma applications; Process control; Productivity; Semiconductor device manufacture;
Conference_Titel :
Semiconductor Manufacturing Technology Workshop Proceedings, 2004
Print_ISBN :
0-7803-8469-5
DOI :
10.1109/SMTW.2004.1393736
