DocumentCode :
2559436
Title :
Multivariable control of multi-zone chemical mechanical polishing
Author :
Shiu, Sheng-Jyh ; Yu, Cheng-Ching ; Shen, Shih-Haur ; An-Jhih Sul
Author_Institution :
Dept. of Chem. Eng., Nat. Taiwan Univ., Taipei, Taiwan
fYear :
2004
fDate :
9-10 Sept. 2004
Firstpage :
107
Lastpage :
110
Abstract :
The modeling and multivariable control of the multi-zone CMP are studied in this work. In the process control notation, the manipulated variables are the three pressures applied to each zone. Therefore, this is a 60×3 non-square multivariable control problem. The singular value decomposition (SVD) is used to design a non-square feedback controller. The proposed control system is test on incoming wafers with different surface profiles. Results show that achievable performance can be maintained using the proposed SVD controller.
Keywords :
chemical mechanical polishing; feedback; multivariable control systems; process control; semiconductor device manufacture; singular value decomposition; multivariable control; multizone chemical mechanical polishing; nonsquare feedback controller; process control; singular value decomposition; Chemicals; Copper; Equations; Input variables; Matrix decomposition; Mechanical variables control; Semiconductor device modeling; Singular value decomposition; Steady-state; US Department of Energy;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing Technology Workshop Proceedings, 2004
Print_ISBN :
0-7803-8469-5
Type :
conf
DOI :
10.1109/SMTW.2004.1393737
Filename :
1393737
Link To Document :
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