DocumentCode
2559436
Title
Multivariable control of multi-zone chemical mechanical polishing
Author
Shiu, Sheng-Jyh ; Yu, Cheng-Ching ; Shen, Shih-Haur ; An-Jhih Sul
Author_Institution
Dept. of Chem. Eng., Nat. Taiwan Univ., Taipei, Taiwan
fYear
2004
fDate
9-10 Sept. 2004
Firstpage
107
Lastpage
110
Abstract
The modeling and multivariable control of the multi-zone CMP are studied in this work. In the process control notation, the manipulated variables are the three pressures applied to each zone. Therefore, this is a 60×3 non-square multivariable control problem. The singular value decomposition (SVD) is used to design a non-square feedback controller. The proposed control system is test on incoming wafers with different surface profiles. Results show that achievable performance can be maintained using the proposed SVD controller.
Keywords
chemical mechanical polishing; feedback; multivariable control systems; process control; semiconductor device manufacture; singular value decomposition; multivariable control; multizone chemical mechanical polishing; nonsquare feedback controller; process control; singular value decomposition; Chemicals; Copper; Equations; Input variables; Matrix decomposition; Mechanical variables control; Semiconductor device modeling; Singular value decomposition; Steady-state; US Department of Energy;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing Technology Workshop Proceedings, 2004
Print_ISBN
0-7803-8469-5
Type
conf
DOI
10.1109/SMTW.2004.1393737
Filename
1393737
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