DocumentCode :
2559437
Title :
Low cycle fatigue analysis and test methodology for fine pitch leaded surface mount components
Author :
Baker, Perry E. ; Kaspari, Daniel K.
Author_Institution :
Avionics & Commun. Div., Rockwell Collins, Cedar Rapids, IA, USA
fYear :
1996
fDate :
29 May-1 Jun 1996
Firstpage :
74
Lastpage :
80
Abstract :
In support of Avionics Integrity Program (AVIP) contracts, Rockwell has implemented a methodology that allows for the rapid evaluation of fine pitch leaded surface mount components. In order to provide an evaluation tool at the front end of the design process, the methodology builds upon a set of simplified equations developed by Werner Engelmaier and Robert Kotlowitz. This paper describes the methodology used to correlate the simplified equations using a combination of Finite Element Analysis (FEA) and temperature cycle life testing. The testing is designed to account for process variability and to verify the FEA results
Keywords :
avionics; fatigue testing; fine-pitch technology; finite element analysis; life testing; surface mount technology; Avionics Integrity Program; Rockwell; fine pitch leaded surface mount component; finite element analysis; low cycle fatigue analysis; temperature cycle life testing; test methodology; Aerospace electronics; Contracts; Equations; Fatigue; Finite element methods; Lead; Shape; Springs; Temperature; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal Phenomena in Electronic Systems, 1996. I-THERM V., Inter-Society Conference on
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-3325-X
Type :
conf
DOI :
10.1109/ITHERM.1996.534547
Filename :
534547
Link To Document :
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