• DocumentCode
    2559437
  • Title

    Low cycle fatigue analysis and test methodology for fine pitch leaded surface mount components

  • Author

    Baker, Perry E. ; Kaspari, Daniel K.

  • Author_Institution
    Avionics & Commun. Div., Rockwell Collins, Cedar Rapids, IA, USA
  • fYear
    1996
  • fDate
    29 May-1 Jun 1996
  • Firstpage
    74
  • Lastpage
    80
  • Abstract
    In support of Avionics Integrity Program (AVIP) contracts, Rockwell has implemented a methodology that allows for the rapid evaluation of fine pitch leaded surface mount components. In order to provide an evaluation tool at the front end of the design process, the methodology builds upon a set of simplified equations developed by Werner Engelmaier and Robert Kotlowitz. This paper describes the methodology used to correlate the simplified equations using a combination of Finite Element Analysis (FEA) and temperature cycle life testing. The testing is designed to account for process variability and to verify the FEA results
  • Keywords
    avionics; fatigue testing; fine-pitch technology; finite element analysis; life testing; surface mount technology; Avionics Integrity Program; Rockwell; fine pitch leaded surface mount component; finite element analysis; low cycle fatigue analysis; temperature cycle life testing; test methodology; Aerospace electronics; Contracts; Equations; Fatigue; Finite element methods; Lead; Shape; Springs; Temperature; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal Phenomena in Electronic Systems, 1996. I-THERM V., Inter-Society Conference on
  • Conference_Location
    Orlando, FL
  • Print_ISBN
    0-7803-3325-X
  • Type

    conf

  • DOI
    10.1109/ITHERM.1996.534547
  • Filename
    534547