DocumentCode
2559437
Title
Low cycle fatigue analysis and test methodology for fine pitch leaded surface mount components
Author
Baker, Perry E. ; Kaspari, Daniel K.
Author_Institution
Avionics & Commun. Div., Rockwell Collins, Cedar Rapids, IA, USA
fYear
1996
fDate
29 May-1 Jun 1996
Firstpage
74
Lastpage
80
Abstract
In support of Avionics Integrity Program (AVIP) contracts, Rockwell has implemented a methodology that allows for the rapid evaluation of fine pitch leaded surface mount components. In order to provide an evaluation tool at the front end of the design process, the methodology builds upon a set of simplified equations developed by Werner Engelmaier and Robert Kotlowitz. This paper describes the methodology used to correlate the simplified equations using a combination of Finite Element Analysis (FEA) and temperature cycle life testing. The testing is designed to account for process variability and to verify the FEA results
Keywords
avionics; fatigue testing; fine-pitch technology; finite element analysis; life testing; surface mount technology; Avionics Integrity Program; Rockwell; fine pitch leaded surface mount component; finite element analysis; low cycle fatigue analysis; temperature cycle life testing; test methodology; Aerospace electronics; Contracts; Equations; Fatigue; Finite element methods; Lead; Shape; Springs; Temperature; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal Phenomena in Electronic Systems, 1996. I-THERM V., Inter-Society Conference on
Conference_Location
Orlando, FL
Print_ISBN
0-7803-3325-X
Type
conf
DOI
10.1109/ITHERM.1996.534547
Filename
534547
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