Title : 
The U1traSPARC T1: A Power-Efficient High-Throughput 32-Thread SPARC Processor
         
        
            Author : 
Leon, Ana Sonia ; Sheahan, Denis
         
        
            Author_Institution : 
Sun Microsyst. Inc., Sunnyvale
         
        
        
        
        
        
            Abstract : 
Throughput computing represents a new paradigm in processor design focusing on maximizing overall throughput of commercial workloads while addressing increasing demands for improved power and cooling in today\´s data centers. The first generation of "Niagara" SPARC processors implements a power-efficient chip multithreading (CMT) architecture, which combines eight 4-threaded 64 b cores, a high bandwidth interconnect crossbar, a shared 3 MB L2 Cache and four double-width DDR2 DRAM interfaces. Implemented in 90 nm CMOS technology, the 378 mm2 die consumes only 63 W at 1.2 GHz. The UltraSPARC Tl based systems are oriented to a wide variety of applications, including WebServers, data and application servers, Java applications, search, streaming video and Telco applications.
         
        
            Keywords : 
microprocessor chips; multi-threading; peripheral interfaces; CMOS DDR2 technology; Java applications; UltraSPARC T1; WebServers; data and application servers; frequency 1.2 GHz; high-throughput 32-thread SPARC processor; power 63 W; power-efficient chip multithreading architecture; throughput computing; Bandwidth; CMOS technology; Computer architecture; Cooling; Java; Multithreading; Power generation; Power system interconnection; Process design; Throughput; Chip MultiThreading (CMT); DSA; EM; GOI; NBTI; Niagara; OpenSPARC; RSA; SSL; T1000; T2000; UltraSPARC T1; high bandwidth; low power; multicore; power management; reliability; thermal management; throughput performance;
         
        
        
        
            Conference_Titel : 
Solid-State Circuits Conference, 2006. ASSCC 2006. IEEE Asian
         
        
            Conference_Location : 
Hangzhou
         
        
            Print_ISBN : 
0-7803-9734-7
         
        
            Electronic_ISBN : 
0-7803-97375-5
         
        
        
            DOI : 
10.1109/ASSCC.2006.357843