• DocumentCode
    2559605
  • Title

    Analytical modeling of Double Gate MOSFET using back gate insulator thickness variation

  • Author

    Vishvakarma, S.K. ; Saxena, A.K. ; Dasgupta, S. ; Fjeldly, Tor A.

  • Author_Institution
    Univ. Grad. Center, Kjeller, Norway
  • fYear
    2009
  • fDate
    1-2 June 2009
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper, presents an analytical modeling of electron density in the active silicon region, the effect of back gate bias on front gate threshold voltage and estimation of the subthreshold slop for Double Gate MOSFETs. The various analyses have been carried out for symmetric and asymmetric structures where the asymmetric nature has been considered by virtue of altering the back gate insulator thicknesses and voltage and subsequently we have observed the variation in inversion charge density and front gate threshold voltage. The modeling of device parameters in this paper has been invoked from an analytical modeling of two-dimensional potential for the asymmetric structure of the device with boundary value approach. Numerical simulations of such structures were done using the device simulator ATLAS.
  • Keywords
    MOSFET; active silicon region; analytical modeling; back gate bias; back gate insulator thickness variation; device simulator ATLAS; double gate MOSFET; electron density; front gate threshold voltage; inversion charge density; metal-oxide-semiconductor field effect transistors; numerical simulation; Analytical models; Circuit simulation; Electron devices; Insulation; MOSFET circuits; Nanoscale devices; Numerical simulation; Poisson equations; Silicon on insulator technology; Threshold voltage; Asymmetric; double gate MOSFET; electron density; potential; symmetric; threshold voltage and subthreshold slop;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices and Semiconductor Technology, 2009. IEDST '09. 2nd International Workshop on
  • Conference_Location
    Mumbai
  • Print_ISBN
    978-1-4244-3831-0
  • Electronic_ISBN
    978-1-4244-3832-7
  • Type

    conf

  • DOI
    10.1109/EDST.2009.5166119
  • Filename
    5166119