Cutting for QFN packaging by diode pumping solid state laser system

Author

Li, Chun-Hao ; Tsai, Ming-Jong ; Chen, Richard ; Lee, Chen-Hau ; Hong, Sheng-Wen

Author_Institution

China Inst. of Technol., Nat. Taiwan Univ. of Sci. & Technol., Taipei

fYear

2004

fDate

10-10 Sept. 2004

Firstpage

123

Lastpage

126

Abstract

This packaging method QFN could reduce thermal-resistance, less size for packaging and weight, suitable for medium or small pads IC with high speed and high frequency applications for products. By such packaging process, QFN ICs need to separate for mounting on the different applications of printed-circuit boards, cutting the strips by saw machine would be fine now for mass production, but there are something worse, including IC crack easy, stress releasing problem, space wasting...and so on. So this paper focus on the result of laser cutting on QFN IC strips by using diode pumped solid state laser system, and describe the detail effect of laser parameters, it would tell us the technology of laser cutting for QFN with excellent good results, the new development for laser applications should be worth for semiconductor industry

Keywords

integrated circuit manufacture; integrated circuit packaging; laser beam cutting; printed circuit manufacture; diode pumping solid state laser system; laser cutting; mass production; printed-circuit board; quad flat no-lead packaging; semiconductor industry; stress releasing problem; Application specific integrated circuits; Integrated circuit packaging; Laser beam cutting; Laser excitation; Packaging machines; Pump lasers; Semiconductor diodes; Semiconductor lasers; Solid lasers; Strips;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Manufacturing Technology Workshop Proceedings, 2004

Conference_Location

Hsinchu

Print_ISBN

0-7803-8469-5

Type

conf

DOI

10.1109/SMTW.2004.1393743

Filename

1393743