Title :
Planning yields in recycling test wafers
Author :
Wu, Muh-Chemg ; Chien, C.S. ; Lu, K.S.
Author_Institution :
Dept. of Ind. Eng. & Manage., Nat. Chiao Tung Univ., Hsinchu
Abstract :
This paper formulates a decision problem and proposes two solution methods for selecting the yield improvement alternatives in the test wafer recycle processes. The decision problem is to determine the yield improvement target for each recycle process in order to minimize the use of test wafers
Keywords :
integrated circuit testing; integrated circuit yield; planning; recycling; semiconductor device manufacture; decision problem; test wafer recycle process; yield improvement; Buffer storage; Cleaning; Engineering management; Industrial engineering; Materials testing; Recycling; Semiconductor device manufacture; Semiconductor device modeling; Semiconductor device testing; System testing;
Conference_Titel :
Semiconductor Manufacturing Technology Workshop Proceedings, 2004
Conference_Location :
Hsinchu
Print_ISBN :
0-7803-8469-5
DOI :
10.1109/SMTW.2004.1393750
