DocumentCode
2559826
Title
Planning yields in recycling test wafers
Author
Wu, Muh-Chemg ; Chien, C.S. ; Lu, K.S.
Author_Institution
Dept. of Ind. Eng. & Manage., Nat. Chiao Tung Univ., Hsinchu
fYear
2004
fDate
10-10 Sept. 2004
Firstpage
141
Lastpage
144
Abstract
This paper formulates a decision problem and proposes two solution methods for selecting the yield improvement alternatives in the test wafer recycle processes. The decision problem is to determine the yield improvement target for each recycle process in order to minimize the use of test wafers
Keywords
integrated circuit testing; integrated circuit yield; planning; recycling; semiconductor device manufacture; decision problem; test wafer recycle process; yield improvement; Buffer storage; Cleaning; Engineering management; Industrial engineering; Materials testing; Recycling; Semiconductor device manufacture; Semiconductor device modeling; Semiconductor device testing; System testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing Technology Workshop Proceedings, 2004
Conference_Location
Hsinchu
Print_ISBN
0-7803-8469-5
Type
conf
DOI
10.1109/SMTW.2004.1393750
Filename
1393750
Link To Document