DocumentCode :
2559995
Title :
A tactile sensor ASIC for a sensorized guidewire in minimally invasive surgical operations
Author :
Chan, Kok Lim ; Tiew, Kei-Tee ; Astuti Lee, Andreas ; Luo, Jianwen ; Ng, Simon Sheung Yan ; Je, Minkyu
Author_Institution :
Inst. of Microelectron., A*STAR (Agency for Sci., Technol. & Res.), Singapore, Singapore
fYear :
2010
fDate :
8-10 Nov. 2010
Firstpage :
1
Lastpage :
4
Abstract :
In this paper, a tactile sensor ASIC for a sensorized guidewire in minimally invasive surgical operations is presented. This ASIC interfaces with Silicon Nanowire (SiNW) sensors, which capture the force exerted at the tip of the guidewire and present it as a resistance value. The resistance is then converted to current pulses in the ASIC. These pulses are transmitted and displayed on an external monitoring module through a 3-wire interconnect, which is also used to carry the control signals and the power supplies for the ASIC. There are three major challenges: limited area due to the integration at the tip of the guidewire together with the sensors, restricted number of interconnecting wires through the guidewire, and huge resistance variations in the SiNW sensors. These challenges are addressed through an incremental double sampling second-order single-OTA ΔΣ ADC, a 3-wire interface with the external module, and a programmable analog front-end, respectively. The chip has been fabricated in 0.18μm CMOS and occupies an area of only 500μm × 650μm. A 7-bit resolution is achieved for the sensor resistance ranging between 20Ω and 800Ω, with an overall power consumption of only 250μW.
Keywords :
application specific integrated circuits; biomedical equipment; nanobiotechnology; nanowires; silicon; surgery; tactile sensors; ASIC tactile sensor; Si; external monitoring module; minimally invasive surgical operation; power 250 muW; programmable analog front end; resistance 20 kohm to 800 kohm; resistance variation; sensorized guidewire; silicon nanowire; Application specific integrated circuits; Capacitors; Electronics packaging; Modulation; Resistance; Sensors; Wires;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid State Circuits Conference (A-SSCC), 2010 IEEE Asian
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-8300-6
Type :
conf
DOI :
10.1109/ASSCC.2010.5716601
Filename :
5716601
Link To Document :
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