• DocumentCode
    2559995
  • Title

    A tactile sensor ASIC for a sensorized guidewire in minimally invasive surgical operations

  • Author

    Chan, Kok Lim ; Tiew, Kei-Tee ; Astuti Lee, Andreas ; Luo, Jianwen ; Ng, Simon Sheung Yan ; Je, Minkyu

  • Author_Institution
    Inst. of Microelectron., A*STAR (Agency for Sci., Technol. & Res.), Singapore, Singapore
  • fYear
    2010
  • fDate
    8-10 Nov. 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In this paper, a tactile sensor ASIC for a sensorized guidewire in minimally invasive surgical operations is presented. This ASIC interfaces with Silicon Nanowire (SiNW) sensors, which capture the force exerted at the tip of the guidewire and present it as a resistance value. The resistance is then converted to current pulses in the ASIC. These pulses are transmitted and displayed on an external monitoring module through a 3-wire interconnect, which is also used to carry the control signals and the power supplies for the ASIC. There are three major challenges: limited area due to the integration at the tip of the guidewire together with the sensors, restricted number of interconnecting wires through the guidewire, and huge resistance variations in the SiNW sensors. These challenges are addressed through an incremental double sampling second-order single-OTA ΔΣ ADC, a 3-wire interface with the external module, and a programmable analog front-end, respectively. The chip has been fabricated in 0.18μm CMOS and occupies an area of only 500μm × 650μm. A 7-bit resolution is achieved for the sensor resistance ranging between 20Ω and 800Ω, with an overall power consumption of only 250μW.
  • Keywords
    application specific integrated circuits; biomedical equipment; nanobiotechnology; nanowires; silicon; surgery; tactile sensors; ASIC tactile sensor; Si; external monitoring module; minimally invasive surgical operation; power 250 muW; programmable analog front end; resistance 20 kohm to 800 kohm; resistance variation; sensorized guidewire; silicon nanowire; Application specific integrated circuits; Capacitors; Electronics packaging; Modulation; Resistance; Sensors; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid State Circuits Conference (A-SSCC), 2010 IEEE Asian
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-8300-6
  • Type

    conf

  • DOI
    10.1109/ASSCC.2010.5716601
  • Filename
    5716601