Title :
Microstrip patch antenna miniaturization using artificial magnetic conductor
Author :
Rahmadani, Fahmi ; Munir, Achmad
Author_Institution :
Radio Telecommun. & Microwave Lab., Inst. Teknol. Bandung, Bandung, Indonesia
Abstract :
This paper deals with an alternative technique for microstrip patch antenna miniaturization is investigated. The technique employs a 2 layer structures with an artificial magnetic conductor (AMC) structure used as the bottom layer replacing the ground plane. The AMC structure is constructed using a textured high impedance surface (HIS) that takes form of a doubly periodic square patches on top of a dielectric substrate. The miniaturization effect that is introduced especially in the reduction of patch size by use of this 2 layer structures will be numerically investigated. The proposed antenna is designed to have a resonant frequency of 2.45MHz suitable for wireless local area network (WLAN) application and is deployed on an FR-4 Epoxy substrate. To obtain the optimum design, numerical analysis is carried out using 3D simulation software. To verify the miniaturization effect, the proposed antenna will be compared to some reference antenna resonates at the same resonant frequency placed on a 2 layers FR-4 Epoxy substrate with the same thickness but without AMC structure. From the result, it is shown that the incorporation of AMC structure can reduce the size of antenna patch by more than 31%.
Keywords :
conductors (electric); microstrip antennas; wireless LAN; 3D simulation software; FR-4 Epoxy substrate; WLAN; alternative technique; artificial magnetic conductor; dielectric substrate; frequency 2.45 MHz; ground plane; microstrip patch antenna miniaturization; numerical analysis; wireless local area network; Microstrip; Microstrip antennas; Patch antennas; Resonant frequency; Substrates; Artifical magnetic conductor; microstrip patch antenna; patch miniaturization; size reduction;
Conference_Titel :
Telecommunication Systems, Services, and Applications (TSSA), 2011 6th International Conference on
Conference_Location :
Bali
Print_ISBN :
978-1-4577-1441-2
DOI :
10.1109/TSSA.2011.6095438