Title :
Development of prediction technique for cooling performance of finned heat sink in uniform flow
Author :
Sata, Yutaka ; Iwasaki, Hideo ; Ishizuka, Masaru
Author_Institution :
Energy & Mech. Labs., Toshiba Corp., Kawasaki, Japan
fDate :
29 May-1 Jun 1996
Abstract :
Numerical simulation was carried out on the flow and the temperature fields around a plate fin array subjected to a uniform flow, varying the ratio of fin length L to the half-pitch of fins s. As Re0s/L decreased, the flow approaching the fin array had a tendency to bypass it and thus the average flow velocity through fins U f became lower, where Re0 is the Reynolds number defined by uniform flow velocity and s. It was also found that frictional resistance and heat transfer of the fins showed excellent agreement with those for the developing flow between parallel plates with uniform inlet flow velocity equal to Uf. A prediction technique for the cooling performance of the array was developed in which Uf was estimated under the condition of constant pressure distribution at its downstream edge. The present technique can predict the heat transfer of the fin array with an error level below 30% under practical conditions of electronics design, although it underestimates Uf in the region of small Re0s/L
Keywords :
cooling; flow; heat sinks; numerical analysis; packaging; temperature distribution; thermal analysis; Reynolds number; constant pressure distribution; cooling performance; electronics design; finned heat sink; frictional resistance; heat transfer; numerical simulation; plate fin array; prediction technique; temperature fields; uniform flow; Coolants; Electronics cooling; Electronics packaging; Heat sinks; Heat transfer; Laboratories; Performance loss; Research and development; Resistance heating; Semiconductor device packaging;
Conference_Titel :
Thermal Phenomena in Electronic Systems, 1996. I-THERM V., Inter-Society Conference on
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-3325-X
DOI :
10.1109/ITHERM.1996.534551