Title :
Numerical and experimental evaluation of planar and staggered heat sinks
Author :
Sathyamurthy, P. ; Runstadler, P.W. ; Lee, S.
Author_Institution :
Fluent Inc., Lebanon, NH, USA
fDate :
29 May-1 Jun 1996
Abstract :
The performance of an air-cooled planar and staggered bonded heat sink is evaluated using both experimental and numerical approaches. The performance is evaluated for three power settings of 100, 150, and 200 W and for three approach velocities at 200, 400, and 600 ft/min. The comparison of the measurements and predictions shows good agreement, indicating that computational methods of the type employed in this work are a cost effective means of designing and evaluating high-performance heat sinks. The results demonstrate that the thermal performance of the staggered fin configuration is superior over the planar fin configuration by approximately 8% over the power and flow ranges examined herein. This enhanced thermal performance, however, was realized at the expense of an additional pressure drop of 10 to 20%
Keywords :
cooling; forced convection; heat sinks; integrated circuit packaging; numerical analysis; temperature distribution; thermal analysis; air-cooled bonded heat sink; approach velocities; computational methods; flow range; high-performance heat sinks; planar fin configuration; planar heat sinks; power range; pressure drop; staggered fin configuration; staggered heat sinks; thermal performance; Bonding; Coolants; Costs; Heat sinks; Heat transfer; Maintenance; Manufacturing; Microelectronics; Temperature; Thermal management of electronics;
Conference_Titel :
Thermal Phenomena in Electronic Systems, 1996. I-THERM V., Inter-Society Conference on
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-3325-X
DOI :
10.1109/ITHERM.1996.534554