DocumentCode
2560794
Title
An overview of Cree silicon carbide power devices
Author
Richmond, Jim ; Ryu, Sei-Hyung ; Das, Mrinal ; Krishnaswami, Sumi ; Hodge, Stuart, Jr. ; Agarwal, Anant ; Palmour, John
fYear
2004
fDate
21-22 Oct. 2004
Firstpage
37
Lastpage
42
Abstract
The compelling system benefits of using silicon carbide (SiC) Schottky diodes have resulted in rapid commercial adoption of this new technology by the power supply industry. Silicon carbide PiN diodes, MOSFET´s, and BJT´s, are approaching the point of development that they could be transitioned to volume production. This work reviews the characteristics of recently produced SiC devices including Schottky diodes, PiN diodes, MOSFET´s, and BJT´s. A comparison of the static and dynamic performance of the SiC devices and typical silicon devices is performed. The results show the performance improvement available with SiC devices. The high temperature performance capabilities of SiC devices are also highlighted.
Keywords
Schottky diodes; carbon compounds; p-i-n diodes; power MOSFET; power bipolar transistors; silicon compounds; wide band gap semiconductors; BJT; Cree inc.; MOSFET; Schottky diodes; SiC; power supply industry; silicon carbide PiN diodes; silicon carbide power devices; static-dynamic performance; temperature performance; Crystalline materials; Gallium arsenide; Production; Schottky diodes; Semiconductor diodes; Semiconductor materials; Silicon carbide; Temperature; Thermal conductivity; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Electronics in Transportation, 2004
Print_ISBN
0-7803-8538-1
Type
conf
DOI
10.1109/PET.2004.1393789
Filename
1393789
Link To Document