• DocumentCode
    2560794
  • Title

    An overview of Cree silicon carbide power devices

  • Author

    Richmond, Jim ; Ryu, Sei-Hyung ; Das, Mrinal ; Krishnaswami, Sumi ; Hodge, Stuart, Jr. ; Agarwal, Anant ; Palmour, John

  • fYear
    2004
  • fDate
    21-22 Oct. 2004
  • Firstpage
    37
  • Lastpage
    42
  • Abstract
    The compelling system benefits of using silicon carbide (SiC) Schottky diodes have resulted in rapid commercial adoption of this new technology by the power supply industry. Silicon carbide PiN diodes, MOSFET´s, and BJT´s, are approaching the point of development that they could be transitioned to volume production. This work reviews the characteristics of recently produced SiC devices including Schottky diodes, PiN diodes, MOSFET´s, and BJT´s. A comparison of the static and dynamic performance of the SiC devices and typical silicon devices is performed. The results show the performance improvement available with SiC devices. The high temperature performance capabilities of SiC devices are also highlighted.
  • Keywords
    Schottky diodes; carbon compounds; p-i-n diodes; power MOSFET; power bipolar transistors; silicon compounds; wide band gap semiconductors; BJT; Cree inc.; MOSFET; Schottky diodes; SiC; power supply industry; silicon carbide PiN diodes; silicon carbide power devices; static-dynamic performance; temperature performance; Crystalline materials; Gallium arsenide; Production; Schottky diodes; Semiconductor diodes; Semiconductor materials; Silicon carbide; Temperature; Thermal conductivity; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Electronics in Transportation, 2004
  • Print_ISBN
    0-7803-8538-1
  • Type

    conf

  • DOI
    10.1109/PET.2004.1393789
  • Filename
    1393789