Table of contents

The following topics are dealt with: magnetically coupled coil structures; PCB-to-active interposer wireless power transfer; 2.5D-3D-IC; hybrid silicon interposer; glass interposer; system-in-package; through silicon vias; vertical links; capacitive coupling; planar interconnections; cylindrical interconnections; S-parameters; bounded size training set; ANN; indirect contact probing method; via arrays; electronic packaging; fast incremental 3D full-wave analysis; package-board design iterations; eigen-GCR; layered media; parallel plate impedance; printed circuit boards; de-embedding method; full wave solver; high speed channels; PCB-package codesign; super wideband X-complementary split ring resonator structure; power distribution network; EMI coupling; command lines; solar array switching strings; spacecraft; modular power system; bus bar scheme; high power communication satellite; flex cables; high speed serial links; SATA 3.0 channels; re-driver; null field preconditioner; fast 3D full-wave MoM package-board extraction; resonant power supply noise reduction; on-die decoupling capacitors; organic interposer; sockets; package-on-package electrical validation & design; BGA package; nonideal ground induced resonance; DDR4 RDIMM; timing margins; guard trace;periodic structure; signal integrity; simultaneous switching output buffers; SSO buffers; interlayer crosstalk; stripline; metal patch; power supply noise; electromagnetic radiation; chip-package anti-resonance; jitter; very long pattern length waveform; inter-die communication; crosstalk reduction; compact optical transceiver module; high-speed data transmission system; half mode substrate integrated waveguide; noise suppression; DC-DC converter; silicon-package power delivery cosimulation; voltage regulators; microprocessors; QPSK schemes; EMC-aware analysis; low-cost receiver circuit; injection locking; common-mode filter design; signal interference technique; wideband common-mode suppression filter; and d- fferential signal transmission.