Title :
Commercial component integration plan for military equipment programs: reliability prediction and part procurement
Author :
McCoog, James R.
Author_Institution :
Lockheed Martin Gov. Electron. Syst., Moorestown, NJ, USA
Abstract :
Due to the military´s loss of influence in the microcircuit industry, resulting in drastically diminishing military component resources, the application of plastic encapsulated microcircuits (PEMs) into Lockheed Martin, GES Naval Sheltered equipment (LM-GES) has become inevitable. The commercial industry´s experience with PEMs and numerous studies, summarized in this paper, conclude that the quality and reliability of PEMs can be comparable to their military hermetic counterparts in a Naval Sheltered environment. LM-GES equipment experience for hermetic parts and the commercial industry´s available data for PEMs is presented showing that the quality and reliability of microcircuits, hermetics and PEMs, has significantly improved. However, the current reliability prediction methods of MIL-HDBK-217 are lagging behind today´s observed microcircuit quality levels
Keywords :
integrated circuit reliability; military equipment; plastic packaging; quality control; reliability theory; MIL-HDBK-217; commercial component integration plan; hermetic parts; microcircuit industry; microcircuit quality levels; military equipment programs; part procurement; plastic encapsulated microcircuits; reliability estimation; reliability prediction methods; Defense industry; Failure analysis; Government; Maintenance; Marketing and sales; Military computing; Military equipment; Physics; Prediction methods; Procurement;
Conference_Titel :
Reliability and Maintainability Symposium. 1997 Proceedings, Annual
Conference_Location :
Philadelphia, PA
Print_ISBN :
0-7803-3783-2
DOI :
10.1109/RAMS.1997.571672