Commercial component integration plan for military equipment programs: reliability prediction and part procurement

Author

McCoog, James R.

Author_Institution

Lockheed Martin Gov. Electron. Syst., Moorestown, NJ, USA

fYear

1997

fDate

13-16 Jan 1997

Firstpage

100

Lastpage

110

Abstract

Due to the military´s loss of influence in the microcircuit industry, resulting in drastically diminishing military component resources, the application of plastic encapsulated microcircuits (PEMs) into Lockheed Martin, GES Naval Sheltered equipment (LM-GES) has become inevitable. The commercial industry´s experience with PEMs and numerous studies, summarized in this paper, conclude that the quality and reliability of PEMs can be comparable to their military hermetic counterparts in a Naval Sheltered environment. LM-GES equipment experience for hermetic parts and the commercial industry´s available data for PEMs is presented showing that the quality and reliability of microcircuits, hermetics and PEMs, has significantly improved. However, the current reliability prediction methods of MIL-HDBK-217 are lagging behind today´s observed microcircuit quality levels

Keywords

integrated circuit reliability; military equipment; plastic packaging; quality control; reliability theory; MIL-HDBK-217; commercial component integration plan; hermetic parts; microcircuit industry; microcircuit quality levels; military equipment programs; part procurement; plastic encapsulated microcircuits; reliability estimation; reliability prediction methods; Defense industry; Failure analysis; Government; Maintenance; Marketing and sales; Military computing; Military equipment; Physics; Prediction methods; Procurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability and Maintainability Symposium. 1997 Proceedings, Annual

Conference_Location

Philadelphia, PA

ISSN

0149-144X

Print_ISBN

0-7803-3783-2

Type

conf

DOI

10.1109/RAMS.1997.571672

Filename

571672