DocumentCode
2561156
Title
Development of a skin temperature measuring system for non-contact stress evaluation
Author
Kataoka, Hisanori ; Kano, Hiroshi ; Yoshida, Hiroaki ; Saijo, Atsuo ; Yasuda, Masashi ; Osumi, Masato
Author_Institution
Hashiridani, Osaka, Japan
Volume
2
fYear
1998
fDate
29 Oct-1 Nov 1998
Firstpage
940
Abstract
Skin temperature is an effective indicator for objectively evaluating human sensations, because it is controlled by sympathetic nerve activity which reflects the course of information processing in the brain. In this paper, the authors show a method to evaluate stress from skin temperature and an equipment which continuously measures skin temperature of an subject working in front of a computer terminal. An experiment is performed to investigate a relationship between stressful task and the skin temperature. The experiment shows that there is a high correlation among stress, skin temperatures on nose and forehead. From this experiment, a regression equation is derived which computes the intensity of stress from skin temperatures on nose and forehead. A non-contact skin temperature measuring system is developed based on knowledge obtained in the experiment. The system comprised of an infrared camera, color camera, image processing unit and workstation. The features are the abilities to track nose and forehead positions of an subject doing computer operation automatically and to evaluate the stress continuously
Keywords
biomedical equipment; infrared imaging; medical image processing; skin; temperature measurement; color camera; forehead; human sensations evaluation; infrared camera; medical instrumentation; noncontact stress evaluation; nose; regression equation; skin temperature measuring system; stress intensity; stressful task; Cameras; Forehead; Humans; Information processing; Nose; Skin; Stress; Temperature control; Temperature measurement; Temperature sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, 1998. Proceedings of the 20th Annual International Conference of the IEEE
Conference_Location
Hong Kong
ISSN
1094-687X
Print_ISBN
0-7803-5164-9
Type
conf
DOI
10.1109/IEMBS.1998.745598
Filename
745598
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