• DocumentCode
    256120
  • Title

    Efficient computation of capacitive coupling between planar and cylindrical interconnections

  • Author

    Ki Jin Han ; Swaminathan, M.

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Ulsan Nat. Inst. of Sci. & Technol., Ulsan, South Korea
  • fYear
    2014
  • fDate
    14-16 Dec. 2014
  • Firstpage
    13
  • Lastpage
    16
  • Abstract
    For the efficiency improvement of 3D path-finding methodology, this paper presents the reduction of computational cost in the calculation of capacitive coupling between planar and cylindrical structures. The previously used global adaptive quadrature for integrations involving the angular variable is replaced by a simple trapezoidal quadrature with the double-exponential transformation. Also, the other integrations over planar variables is approximated to a simple summation. From the verifications of the proposed technique for various coupling structures shows that the updated modeling method reduces the computation time by up to 12%.
  • Keywords
    integrated circuit interconnections; 3D path-finding methodology; capacitive coupling; computational cost reduction; cylindrical interconnections; cylindrical structures; double-exponential transformation; global adaptive quadrature; planar interconnections; planar structures; trapezoidal quadrature; Biological system modeling; Computational modeling; Finite element analysis; Inductance; Packaging; Periodic structures; Transforms;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), 2014 IEEE
  • Conference_Location
    Bangalore
  • Type

    conf

  • DOI
    10.1109/EDAPS.2014.7030803
  • Filename
    7030803