DocumentCode :
256128
Title :
Effect of layered media on the parallel plate impedance of printed circuit boards
Author :
Dahl, D. ; Muller, S. ; Schuster, C.
Author_Institution :
Tech. Univ. Hamburg-Harburg (TUHH), Hamburg, Germany
fYear :
2014
fDate :
14-16 Dec. 2014
Firstpage :
29
Lastpage :
32
Abstract :
This paper evaluates the impact of layered media on the parallel plate impedance of printed circuit boards. In the parallel plate impedance computation using the radial waveguide method (RWM) for infinite planes and a contour integral method (CIM) for finite planes, the layered nature of investigated structures can be accounted for by effective wave numbers. Here, the effective wave numbers are obtained using either an exact solution from the transverse resonance method (TRM) or adopting approximations based on the assumption of quasi-TEM fields and the applicability of suitable averages. The wave numbers obtained with these techniques are compared for typical structures of interest, and the parallel plate impedance computed with effective wave numbers is evaluated and compared to a full wave solution. The results show that a comparatively simple approximation for the effective wave number is sufficient for an accurate parallel plate impedance calculation.
Keywords :
electric impedance; inhomogeneous media; printed circuits; waveguides; contour integral method; effective wave numbers; infinite planes; layered media effect; parallel plate impedance; printed circuit boards; quasiTEM fields; radial waveguide method; transverse resonance method; Approximation methods; Dielectric losses; Impedance; Nonhomogeneous media; Permittivity; Transmission line measurements; contour integral method; layered media; parallel plate impedance; parallel plate waveguide; radial waveguide method; transverse resonance method; wave number;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), 2014 IEEE
Conference_Location :
Bangalore
Type :
conf
DOI :
10.1109/EDAPS.2014.7030807
Filename :
7030807
Link To Document :
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