Title : 
A case study of BGA package for high speed channel with non-ideal ground induced resonance conditions
         
        
            Author : 
Singh, V.K. ; Nagpal, R.K. ; Tripathi, J.N.
         
        
            Author_Institution : 
STMicroelectron. Pvt. Ltd., Noida, India
         
        
        
        
        
        
            Abstract : 
Proper transmission of high speed signal requires sufficiently high bandwidth of the medium. The reference planes play a vital role in achieving distortion-free signal propagation. In this paper a BGA package design exhibiting resonance conditions in insertion loss is analyzed. Analysis led to ground path issues caused by return current density congestions. Improvement in ground return path layout led to elimination of resonance conditions. Re-designed package is meeting the intended design target for HDMI 2.0 standards.
         
        
            Keywords : 
ball grid arrays; BGA package design; HDMI 2.0 standards; distortion-free signal propagation; ground path issue; ground return path layout improvement; high-speed channel; high-speed signal transmission; insertion loss; nonideal ground-induced resonance conditions; re-designed package; return current density congestions; Bandwidth; Inductance; Insertion loss; Integrated circuit modeling; Noise; Ports (Computers); Substrates; Bandwidth; HDMI 2.0 specification; Insertion loss; Micro-Strip line; Wire-bond BGA package; return loss;
         
        
        
        
            Conference_Titel : 
Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), 2014 IEEE
         
        
            Conference_Location : 
Bangalore
         
        
        
            DOI : 
10.1109/EDAPS.2014.7030809