DocumentCode :
2561540
Title :
A 6-b DAC and Analog DRAM for a Maskiess Lithography Interface in 90 nm CMOS
Author :
Fang, David ; Roberts, Ryan ; Nikolic, Borivoje
Author_Institution :
Univ. of California, Berkeley
fYear :
2006
fDate :
13-15 Nov. 2006
Firstpage :
423
Lastpage :
426
Abstract :
A parallel, 12 mum-pitch, low-power 6-b segmented digital-to-analog converter (DAC) array drives an array of 3 mum x 3 mum analog DRAM cells in a 2.5/1 V 90 nm CMOS process, with an application in maskless lithography. An innovative self-calibrating compensation circuit limits the effect of charge leakage and capacitive process mismatch to less than 0.5 LSB over 100 ms of data hold time. A 2 mm x 2 mm test chip implements a mixed-signal interface with 32 DACs driving four 32 times 256 analog DRAM arrays.
Keywords :
CMOS memory circuits; DRAM chips; digital-analogue conversion; low-power electronics; photolithography; CMOS technology; analog DRAM; capacitive process mismatch; charge leakage; data hold time; digital-to-analog converter; maskless lithography interface; mixed-signal interface; self-calibrating compensation circuit; size 2 mm; size 3 mum; size 90 nm; voltage 1 V to 2.5 V; word length 6 bit; CMOS process; CMOS technology; Costs; Lithography; Mirrors; Optical modulation; Prototypes; Random access memory; Throughput; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Circuits Conference, 2006. ASSCC 2006. IEEE Asian
Conference_Location :
Hangzhou
Print_ISBN :
0-7803-9734-7
Electronic_ISBN :
0-7803-97375-5
Type :
conf
DOI :
10.1109/ASSCC.2006.357941
Filename :
4197680
Link To Document :
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