Title :
Silicon-package power delivery co-simulation with Fully Integrated Voltage Regulators on microprocessors
Author :
Govindan, S. ; Venkataraman, S.
Author_Institution :
Intel Technol. India Private Ltd., Bangalore, India
Abstract :
Fully Integrated Voltage Regulator (FIVR) has been introduced on Intel® Xeon® microprocessors which are switching power converters on die. The FIVR design includes air core inductor structures implemented on the package along with output capacitor, compensators, power transistors and control circuits implemented on-die. FIVR analysis has to comprehend and co-optimize both the package and the die. The power delivery analysis of FIVR is presented and design optimizations are discussed.
Keywords :
circuit optimisation; circuit simulation; elemental semiconductors; integrated circuit design; integrated circuit packaging; microprocessor chips; silicon; switching convertors; voltage regulators; FIVR design; Intel Xeon microprocessors; Si; air core inductor structures; compensators; control circuits; design optimizations; fully integrated voltage regulators; output capacitor; power transistors; silicon-package power delivery co-simulation; switching power converters; Analytical models; Bandwidth; Frequency-domain analysis; Inductors; Integrated circuit modeling; Load modeling; Power transistors;
Conference_Titel :
Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), 2014 IEEE
Conference_Location :
Bangalore
DOI :
10.1109/EDAPS.2014.7030828
