DocumentCode :
2561788
Title :
The effect of application variables on thick-film capacitor dielectrics
Author :
Rose, Adrian
Author_Institution :
Engelhard Corp., East Newark, NJ, USA
fYear :
1988
fDate :
9-11 May 1988
Firstpage :
636
Lastpage :
640
Abstract :
A previously reported series of thick-film capacitor dielectrics with K´s ranging from 10 to 1000 and high Q´s for use in real-world multilayer applications is examined. Circuits were fired at the standard 850°C firing temperature. Firing in both a conventional and a fast-fire furnace showed that the dielectrics are not very sensitive to furnace profile. Properties of capacitors, between layers and on top of multilayer circuits, were measured. Experiments showed that these inks are usable not only with termination designed for them but also with a variety of gold and silver alloy conductors, including some specifically designed for multilayer circuits. It is concluded that incorporation into multilayer circuits is possible for these dielectrics, both for buried capacitors and on the top layer
Keywords :
dielectric materials; thick film capacitors; 850 C; Au; PdAg; PtAg conductor; application variables; buried capacitors; firing temperature; furnace profile; multilayer circuits; thick-film capacitor dielectrics; Capacitors; Circuits; Dielectric measurements; Firing; Furnaces; Gold; Ink; Nonhomogeneous media; Silver; Temperature sensors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Components Conference, 1988., Proceedings of the 38th
Conference_Location :
Los Angeles, CA
Type :
conf
DOI :
10.1109/ECC.1988.12660
Filename :
12660
Link To Document :
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